MAX16838ATP/V+ Maxim Integrated, MAX16838ATP/V+ Datasheet - Page 2

• Manufacturer Part Number: MAX16838ATP/V+
• Description: LED Lighting Drivers Integrated 2-Channel High-Brightness LED Drivers with High-Voltage DC-DC Controller
• Manufacturer: Maxim Integrated

Specifications of MAX16838ATP/V+

• Input Voltage: 4.75 V to 40 V
• Maximum Supply Current: 3.1 mA
• Power Dissipation: 2051 mW

ELECTRICAL CHARACTERISTICS
(V
= V
values are at T
Integrated, 2-Channel, High-Brightness LED Driver
with High-Voltage Boost and SEPIC Controller
ABSOLUTE MAXIMUM RATINGS
IN, OUT_, DRAIN to SGND ...................................-0.3V to +45V
EN to SGND ...............................................-0.3V to (V
PGND to SGND ....................................................-0.3V to +0.3V
LEDGND to SGND ...............................................-0.3V to +0.3V
DRV to PGND .......... -0.3V to the lower of (V
GATE to PGND ........................................................-0.3V to +6V
NDRV to PGND .......................................-0.3V to (V
V
RT, COMP, ISET to SGND .........................-0.3V to (V
DRAIN and CS Continuous Current .................................. Q2.5A
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
20 TQFN
2
PACKAGE THERMAL CHARACTERISTICS (Note 1)
Input Voltage Range
Input Voltage Range
Quiescent Supply Current
Standby Supply Current
Undervoltage Lockout
Undervoltage Lockout Hysteresis
DRV REGULATOR
Output Voltage
Dropout Voltage
Short-Circuit Current Limit
V
Threshold
V
CC
IN
Juction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
CC
CC
CS
______________________________________________________________________________________
, FLT, DIM, CS, OV, CFB, to SGND .................-0.3V to +6V
= V
Undervoltage Lockout
(UVLO) Hysteresis
= V
EN
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
LEDGND
PARAMETER
= 12V, R
A
= 25NC.) (Note 2)
= V
RT
DIM
= 12.2kI, R
= V
PGND
ISET
(V
UVLO
= V
SYMBOL
UVLO
IN
V
= 15kI, C
V
V
V
I
- V
SGND
DRV
I
SH
DO
Q
IN
IN
JC
VCC
DRV
IN
IN
JA
) ............... +6NC/W
+ 0.3V) and +6V
) .......... +39NC/W
= 0V, V
)
Internal LDO on
V
V
V
V
5.75V < V
6.5V < V
V
DRV shorted to GND
V
VCC
IN
DIM
EN
IN
IN
CC
DRV
CC
IN
= V
rising, V
= 4.75V, I
= SGND (Note 3)
rising
GATE
= 1FF, V
= 5V
+ 0.3V)
+ 0.3V)
+ 0.3V)
CC
IN
IN
< 40V, 0.1mA < I
= V
DIM
< 10V, 0.1mA < I
OUT
CC
NDRV
CONDITIONS
= 5V
= V
= 30mA
OUT_ Continuous Current ................................................175mA
V
Continuous Power Dissipation (T
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Soldering Temperature (reflow) ......................................+260NC
20 TSSOP
, T
DRV
20-Pin TQFN (derate 25.6mW/NC above +70NC) ............2051mW
20-Pin TSSOP (derate 26.5mW/NC above +70NC) ......2122mW
DRV
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
A
= T
Short-Circuit Duration .....................................Continuous
= V
LOAD
J
CFB
LOAD
= -40NC to +125NC, unless otherwise noted. Typical
, DRAIN, COMP, OUT_, FLT = unconnected, V
< 3mA
< 30mA
4.75
4.55
4.75
MIN
3.4
4
A
= +70NC)
TYP
15.5
0.11
177
123
3.1
4.3
4.0
97
5
JC
) ............... +2NC/W
JA
MAX
4.55
5.25
5.5
0.5
4.4
40
40
) ..... +37.7NC/W
5
UNITS
mA
mA
mV
mV
FA
V
V
V
V
V
V
OV