AL5812MP-13 Diodes Inc., AL5812MP-13 Datasheet - Page 3
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AL5812MP-13
Manufacturer Part Number
AL5812MP-13
Description
LED Lighting Drivers 60V 150mA ADJ Linear LED Driver
Manufacturer
Diodes Inc.
Datasheet
1.AL5812FF-7.pdf
(12 pages)
Specifications of AL5812MP-13
Rohs
yes
Input Voltage
3.5 V to 60 V
Maximum Supply Current
500 uA
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Package / Case
MSOP-8EP
Minimum Operating Temperature
- 40 C
Power Dissipation
366 mW
Absolute Maximum Ratings
Note:
Caution:
Package Thermal Data
Notes:
Recommended Operating Conditions
Notes:
AL5812
Document number: DS35616 Rev. 2 - 2
U-DFN3030-6
MSOP-8EP
ESD CDM
ESD HBM
Package
Symbol
Symbol
V
V
V
V
I
V
I
T
RSET
T
LED
T
LED
LED
LED
CC
CC
ST
4.V
Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when
handling and transporting these devices.
5. Test condition for MSOP-8EP: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and
6. Test condition for U-DFN3030-6: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and
7. Dominant conduction path via exposed pad.
8. For improved accuracy LED current should be greater than 60mA.
9. Maximum LED current is also limited by ambient temperature and power dissipation such that junction temperature should be kept less than or equal
A
J
thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed
to +125°C.
CC
pin can be greater or smaller than V
Supply Voltage Relative to GND Pin (Note 4)
LED Pin Voltage Relative to GND Pin (Note 4)
R
LED Pin Current Sink Current Range
Human Body Model ESD Protection
Charged Device Model ESD Protection
Operating Junction Temperature
Storage Temperature
Supply Voltage Range Relative to GND Pin
LED Pin Output Voltage Range Relative to GND Pin
LED Pin Current (Notes 8 & 9)
Operating Ambient Temperature Range
SET
Thermal Resistance
Junction-to-Case
Pin Voltage Relative to GND
(Note 7)
θ
39
14
JC
Parameters
Parameter
(@T
LED
A
; neither should go below GND.
= +25°C, unless otherwise specified.)
Junction-to-Ambient
Thermal Resistance
90°C/W (Note 5)
69°C/W (Note 6)
(@T
(Note 7)
www.diodes.com
θ
A
JA
= +25°C, unless otherwise specified.)
3 of 12
-40 to +150
-55 to +150
-0.3 to +66
-0.3 to +66
-0.3 to +6
Ratings
Min
165
1.2
3.5
-40
10
1
1
T
A
= +25°C, T
(Note 7)
1.47W
1.1W
+125
P
Max
150
60
60
DIS
Unit
J
mA
kV
kV
°C
°C
V
V
V
= +125°C
Unit
mA
°C
V
© Diodes Incorporated
December 2012
AL5812
be