MAX17512ATP+ Maxim Integrated, MAX17512ATP+ Datasheet - Page 13

• Manufacturer Part Number: MAX17512ATP+
• Description: Current & Power Monitors & Regulators High Speed Valley Current Regulator
• Manufacturer: Maxim Integrated

Specifications of MAX17512ATP+

• Product: Current Regulators
• Supply Voltage - Max: 18 V
• Supply Voltage - Min: 6.5 V
• Input Voltage Range: 6.5 V to 18 V

The maximum power that can be dissipated in the device
is 2666mW at +70NC temperature. The power-dissipation
capability should be derated, as the temperature goes
above +70NC at 33mW/NC. For a multilayer board, the ther-
mal-performance metrics for the package are as follows:
The junction temperature rise of the device can be
estimated at any given maximum ambient temperature
(T
If the application has a thermal-management system that
ensures that the exposed pad of the device is maintained
at a given temperature (T
sinks, then the junction temperature rise of the device
can be estimated at any given maximum ambient tem-
perature from the following equation:
A_MAX
) from the following equation:
T
High-Speed, Constant On-Time, Valley Current
T
=
J_MAX
J_MAX
=
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θ
T
T
JA
θ
EP_MAX
A_MAX
JC
=
EP_MAX
=
30°C/W
2°C/W
+ θ
+ θ
(
(
), by using proper heat-
JA
JC
Regulator for Tracking Applications
×
×
P
P
LOSS
LOSS
)
)
All connections carrying pulsed currents must be very
short and as wide as possible. The inductance of these
connections must be kept to an absolute minimum due
to the high di/dt of the currents in high-frequency switch-
ing power converters. This implies that the loop areas for
forward and return pulsed currents in various parts of the
circuit should be minimized. Additionally, small-current
loop areas reduce radiated EMI. Similarly, the heatsink
of the main MOSFET presents a dV/dt source; therefore,
the surface area of the MOSFET heatsink should be mini-
mized as much as possible.
Ground planes must be kept as intact as possible. The
ground plane for the power section of the converter
should be kept separate from the analog ground plane,
except for a connection at the least noisy section of the
power ground plane, typically the return of the PVCC filter
capacitor. PCB layout also affects the thermal perfor-
mance of the design. A number of thermal vias that con-
nect to a large ground plane should be provided under
the exposed pad of the device for efficient heat dissipa-
tion. For a sample layout that ensures first-pass success,
refer to the MAX17512 evaluation kit layout available at
www.maxim-ic.com.
Layout, Grounding, and Bypassing
MAX17512