93LC66B-I/SN Microchip Technology, 93LC66B-I/SN Datasheet - Page 13

• Manufacturer Part Number: 93LC66B-I/SN
• Description: IC EEPROM 4KBIT 2MHZ 8SOIC
• Manufacturer: Microchip Technology

Specifications of 93LC66B-I/SN

• Memory Size: 4K (256 x 16)
• Package / Case: 8-SOIC (3.9mm Width)
• Operating Temperature: -40°C ~ 85°C
• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Speed: 2MHz
• Interface: Microwire, 3-Wire Serial
• Voltage - Supply: 2.5 V ~ 5.5 V
• Organization: 256 K x 16
• Interface Type: Microwire
• Maximum Clock Frequency: 2 MHz
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Current: 2 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 2.5 V, 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 93LC66B-I/SNG; 93LC66B-I/SNG

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
 2003 Microchip Technology Inc.
93AA66A/B/C, 93LC66A/B/C, 93C66A/B/C
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint (Reference)
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MO-187
Drawing No. C04-111
p
B
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
c
n
β
(F)
Dimension Limits
E1
E
Units
A2
E1
A1
E
D
F
B
n
p
A
L
φ
c
α
β
MIN
.030
.000
.016
.003
.009
0°
5°
5°
-
.193 TYP.
2
1
.026 BSC
.118 BSC
.118 BSC
.037 REF
INCHES
NOM
D
L
.033
.024
.006
.012
-
-
-
-
-
φ
8
A
MAX
A1
.043
.037
.006
.009
.016
.031
15°
15°
8°
MIN
0.75
0.00
0.40
0.08
0.22
0°
5°
5°
-
MILLIMETERS*
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
0.85
0.60
-
-
-
-
-
-
-
8
α
DS21795B-page 13
MAX
1.10
0.95
0.15
0.80
0.23
0.40
15°
15°
8°
A2