MC10EP52DT ON Semiconductor, MC10EP52DT Datasheet - Page 11

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MC10EP52DT

Manufacturer Part Number
MC10EP52DT
Description
Flip Flops 3.3V/5V ECL D-Type
Manufacturer
ON Semiconductor
Datasheet

Specifications of MC10EP52DT

Product Category
Flip Flops
Number Of Circuits
1
Logic Family
10
Logic Type
D-Type Flip-Flop
Polarity
Inverting/Non-Inverting
Input Type
Differential
Output Type
Differential
Propagation Delay Time
0.38 ns
High Level Output Current
- 50 mA
Low Level Output Current
50 mA
Supply Voltage - Max
- 5.5 V, 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
TSSOP-8
Minimum Operating Temperature
- 40 C
Number Of Input Lines
1
Number Of Output Lines
1
Factory Pack Quantity
100
Supply Voltage - Min
- 3 V
0.15 (0.006) T
0.15 (0.006) T
−T−
0.10 (0.004)
SEATING
PLANE
L
U
U
S
S
PIN 1
IDENT
D
2X
L/2
C
8
1
−V−
A
8x
4
5
K
G
0.10 (0.004)
REF
−U−
B
PLASTIC TSSOP PACKAGE
PACKAGE DIMENSIONS
M
http://onsemi.com
T
CASE 948R−02
DT SUFFIX
U
TSSOP−8
DETAIL E
ISSUE A
S
11
DETAIL E
V
S
F
0.25 (0.010)
M
−W−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
5. TERMINAL NUMBERS ARE SHOWN FOR
6. DIMENSION A AND B ARE TO BE DETERMINED
Y14.5M, 1982.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
REFERENCE ONLY.
AT DATUM PLANE -W-.
DIM
M
A
B
C
D
F
G
K
L
MILLIMETERS
MIN
2.90
2.90
0.80
0.05
0.40
0.25
0
0.65 BSC
4.90 BSC
_
MAX
3.10
3.10
1.10
0.15
0.70
0.40
6
_
0.031
0.002
0.016
0.010
0.114
0.114
MIN
0.026 BSC
0.193 BSC
0
INCHES
_
0.122
0.122
0.043
0.006
0.028
0.016
MAX
6
_

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