DS3172N Maxim Integrated, DS3172N Datasheet - Page 2
DS3172N
Manufacturer Part Number
DS3172N
Description
Network Controller & Processor ICs Dual DS3/E3 Single Chip Transceiver
Manufacturer
Maxim Integrated
Datasheet
1.DS3171.pdf
(234 pages)
Specifications of DS3172N
Part # Aliases
90-31720-N00
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FEATURES (CONTINUED
DETAILED DESCRIPTION
The DS3171 (single), DS3172 (dual), DS3173 (triple), and DS3174 (quad) perform framing, formatting, and line
transmission and reception. These devices contain integrated LIU(s), framer/formatter for M23 DS3, C-bit DS3,
G.751 E3, G.832 E3, or a combination of the above signal formats.
Each LIU has independent receive and transmit paths. The receiver LIU block performs clock and data recovery
from a B3ZS- or HDB3-coded AMI signal and monitors for loss of the incoming signal, or can be bypassed for
direct clock and data inputs. The receiver LIU block optionally performs B3ZS/HDB3 decoding. The transmitter LIU
drives standard pulse-shape waveforms onto 75Ω coaxial cable or can be bypassed for direct clock and data
outputs. The jitter attenuator can be placed in either transmit or receive data path when the LIU is enabled. The
DS3/E3 framers transmit and receive serial data in properly formatted M23 DS3, C-bit DS3, G.751 E3, or G.832 E3
data streams. Unused functions can be powered down to reduce device power. The DS317x DS3/E3 SCTs
conform to the telecommunications standards listed in Section
Loopbacks Include Line, Diagnostic, Framer,
Payload, and Analog with Capabilities to Insert
AIS in the Directions Away from Loopback
Directions
Ports can be Disabled to Reduce Power
Integrated Clock Rate Adapter to Generate the
Remaining Internally Required 44.736MHz (DS3)
and 34.368MHz (E3) from a Single Clock
Reference Source at One of Three Standard
Frequencies (DS3, E3, STS-1)
)
2
4.
Pin Compatible with the DS318x Family of
Devices and the DS316x Family of Devices
8-/16-Bit Generic Microprocessor Interface
Low-Power (~1.73W) 3.3V Operation (5V
Tolerant I/O)
Small High-Density Thermally Enhanced Plastic
BGA Packaging (TE-PBGA) with 1.27mm Pitch
Industrial Temperature Operation:
-40°C to +85°C
IEEE1149.1 JTAG Test Port
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