AT93C46D-PU Atmel, AT93C46D-PU Datasheet - Page 19

• Manufacturer Part Number: AT93C46D-PU
• Description: IC EEPROM 1KBIT 2MHZ 8DIP
• Manufacturer: Atmel

Specifications of AT93C46D-PU

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 1K (128 x 8 or 64 x 16)
• Speed: 250kHz, 1MHz, 2MHz
• Interface: 3-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Organization: 128 K x 8 or 64 K x 16
• Interface Type: 3-Wire
• Maximum Clock Frequency: 2 MHz
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Maximum Operating Current: 2 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 1.8 V, 5.5 V
• Capacitance, Input: 5 pF
• Capacitance, Output: 5 pF
• Current, Input, Leakage: 0.1 μA
• Current, Operating: 2 mA
• Current, Output, Leakage: 0.1
• Data Retention: 100 yrs.
• Density: 1K
• Package Type: PDIP
• Temperature, Operating: -40 to +85 °C
• Time, Address Setup: 200
• Time, Fall: 1000 ns
• Time, Rise: 1000 ns
• Voltage, Input, High: 2.8 to 6.5 V
• Voltage, Input, Low: 0.54 to 1.65 V
• Voltage, Output, High: 1.6 V
• Voltage, Output, Low: 0.2 V
• Voltage, Supply: 1.8 to 5.5 V
• Memory Configuration: 128 X 8, 64 X 16
• Clock Frequency: 2MHz
• Supply Voltage Range: 1.8V To 5.5V
• Memory Case Style: DIP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8Y6 – MLP 2x3
5193F–SEEPR–1/08
Notes:
R
2325 Orchard Parkway
San Jose, CA 95131
1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
tolerances, datums, etc.
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
device through this pad, so if soldered it should be tied to ground
D
Pin 1
Pin 1
Index
Index
Area
Area
TITLE
8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map,
Dual No Lead Package (DFN) ,(MLP 2x3)
A3
A3
A2
A2
A
A1
A1
SYMBOL
D
E
D2
E2
A
A1
A2
A3
L
e
b
1.40
0.20
0.20
COMMON DIMENSIONS
MIN
0.0
(Unit of Measure = mm)
-
-
-
1.50 REF.
1.50 REF.
e (6X)
e (6X)
D2 D2
2.00 BSC
3.00 BSC
0.50 BSC
0.20 REF
NOM
1.50
0.02
0.30
0.25
-
-
-
MAX
1.60
1.40
0.60
0.05
0.55
0.40
0.30
DRAWING NO.
AT93C46D
8Y6
NOTE
(8X)
(8X)
2
Pin 1 ID
Pin 1 ID
b
L (8X)
L (8X)
10/16/07
REV.
D
19