BD90GC0WEFJ-E2 ROHM Semiconductor, BD90GC0WEFJ-E2 Datasheet - Page 16

• Manufacturer Part Number: BD90GC0WEFJ-E2
• Description: Low Dropout Controllers - LDO LDO Reg Pos 9.0V 1A
• Manufacturer: ROHM Semiconductor

Specifications of BD90GC0WEFJ-E2

• Rohs: yes
• Input Voltage Max: 14 V
• Output Voltage: 9 V
• Output Current: 1 A
• Output Type: Fixed
• Number Of Outputs: 1
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: HTSOP-8
• Input Voltage Min: 4.5 V
• Maximum Power Dissipation: 2110 mW
• Minimum Operating Temperature: - 25 C

●Operational Notes
TSZ22111･15･001
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BDxxGC0WEFJ
(1). Absolute maximum ratings
(2). Connecting the power supply connector backward
(3). Power supply lines
(4). GND voltage
(5). Thermal design
(6). Inter-pin shorts and mounting errors
(7). Actions in strong electromagnetic field
(8). ASO
(9). Thermal shutdown circuit
(10). Testing on application boards
etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an
open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit
protection devices, such as fuses.
supply lines. An external direction diode can be added.
The potential of GND pin must be minimum potential in all operating conditions.
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
supply line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power
supply terminals to ICs, connect a capacitor between the power supply and the GND terminal. When applying
electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures.
conditions.
any connection error or if pins are shorted together.
malfunction.
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its
operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the
operation of this circuit is assumed.
IC to stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before
connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly
steps as an antistatic measure. Use similar precaution when transporting or storing the IC.
BDxxGC0WEFJ
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions,
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the
TSD ON Temperature[℃] (typ.)
175
16/19
Hysteresis Temperature [℃] (typ.)
TSZ02201-0R6R0A600200-1-2
15
25.July.2012 Rev.001
Datasheet