MAX4951CCTP+TGH7 Maxim Integrated, MAX4951CCTP+TGH7 Datasheet - Page 2

• Manufacturer Part Number: MAX4951CCTP+TGH7
• Description: Buffers & Line Drivers SATA I/II/III Bidirectional Redriver with Input Equalization and Preemphasis
• Manufacturer: Maxim Integrated

Specifications of MAX4951CCTP+TGH7

• Number Of Input Lines: /
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 3 V

ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
(Note 3)
SATA I/SATA II Bidirectional Re-Driver
(Voltages referenced to GND.)
V
HAP, HAM, DBP, DBM, EN, BA, BB
Short-Circuit Output Current
Continuous Current at Inputs
Continuous Current
Note 1: All I/O pins are clamped by internal diodes.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Operating Power-Supply Range
Operating Supply Current
Standby Supply Current
Single-Ended Input Resistance
Differential Input Resistance
Single-Ended Output Resistance
Differential Output Resistance
AC PERFORMANCE
Differential Input Return Loss
(Note 4)
Common-Mode Input Return Loss
(Note 4)
CC
CC
(Note 1)...................................................-0.3V to (V
(HBP, HBM, DAP, DAM) .................................................90mA
(HAP, HAM, DBP, DBM) ...............................................±30mA
(EN, BA, BB) ...................................................................±5mA
_______________________________________________________________________________________
........................................................................-0.3V to +4.0V
= +3.0V to +3.6V, C
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
L
= 10nF, R
L
= 50Ω, T
Z
Z
Z
Z
RL
SYMBOL
RX-DIFF-DC
TX-DIFF-DC
RL
RX-SE-DC
TX-SE-DC
I
RX-DIFF
V
STBY
I
RX-CM
CC
A
CC
= 0°C to +70°C, unless otherwise noted. Typical values are at V
CC
BA = BB = V
BA = BB = GND
EN = GND
f = 150MHz to 300MHz
f = 300MHz to 600MHz
f = 600MHz to 1200MHz
f = 1.2GHz to 2.4GHz
f = 2.4GHz to 3.0GHz
f = 3.0GHz to 5.0GHz
f = 150MHz to 300MHz
f = 300MHz to 600MHz
f = 600MHz to 1200MHz
f = 1.2GHz to 2.4GHz
f = 2.4GHz to 3.0GHz
f = 3.0GHz to 5.0GHz
+ 0.3V)
CC
CONDITIONS
Continuous Power Dissipation (T
Junction-to-Case Thermal Resistance (θ
Junction-to-Ambient Thermal Resistance (θ
Operating Temperature Range...............................0°C to +70°C
Storage Temperature Range .............................-55°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
20-Pin TQFN (derate 25.6mW/°C above +70°C) ..... 2051mW
20-Pin TQFN...................................................................6°C/W
20-Pin TQFN.................................................................39°C/W
MIN
3.0
40
85
40
85
A
= +70°C)
TYP
100
100
-29
-26
-22
-18
-15
-14
90
70
CC
7
JC
= +3.3V, T
) (Note 2)
JA
) (Note 2)
MAX
125
100
115
115
-18
-14
-10
3.6
10
-8
-3
-1
-5
-5
-2
-2
-2
-1
A
= +25°C.)
UNITS
mA
mA
dB
dB
Ω
Ω
Ω
Ω
V