MAX4952BCTP+T Maxim Integrated, MAX4952BCTP+T Datasheet - Page 2

• Manufacturer Part Number: MAX4952BCTP+T
• Description: Buffers & Line Drivers SINGALE LANE SAS RE-DRIVER
• Manufacturer: Maxim Integrated

Specifications of MAX4952BCTP+T

• Number Of Input Lines: 2
• Number Of Output Lines: 2
• Polarity: Non-Inverting
• Supply Voltage - Max: 3 V
• Supply Voltage - Min: 3.6 V
• Data Rate: 6 Gbps

Dual 1.5/3.0/6.0Gbps SAS/SATA Redriver
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
V
All Other Pins (Note 1) ............................. -0.3V to (V
Short-Circuit Output Current DAP, DAM, HBM, HBP .........90mA
Continuous Power Dissipation (T
Junction-to-Case Thermal Resistance (B
Note 1: All I/O pins are clamped by internal diodes.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
wise noted. Typical values are at V
2
DC PERFORMANCE
Power-Supply Range
Power-Down Current
Supply Current
Input Impedance, Differential
Output Impedance, Differential
AC PERFORMANCE
Input Return Loss, Differential
(Note 4)
Input Return Loss,
Common Mode (Note 4)
CC
20-Pin TQFN (derate 25.6mW/NC above +70NC) .......2051mW
20-Pin TQFN ...................................................................6NC/W
CC
______________________________________________________________________________________
.......................................................................-0.3V to +4.0V
= +3.0V to +3.6V, C
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
CL
= 10nF coupling capacitor on each output, R
A
= +70NC)
CC
RL
SYMBOL
Z
Z
RL
I
= +3.3V and T
PWRDN
RX-DIFF-
TX-DIFF-
RX-DIFF
V
JC
I
RX-CM
DC
DC
CC
CC
) (Note 2)
EN = GND
EN = V
DC
DC
0.1GHz < f P 0.3GHz
0.3GHz < f P 0.6GHz
0.6GHz < f P 1.2GHz
1.2GHz < f P 2.4GHz
2.4GHz < f P 3.0GHz
3.0GHz < f P 6.0GHz
0.1GHz < f P 0.3GHz
0.3GHz < f P 0.6GHz
0.6GHz < f P 1.2GHz
1.2GHz < f P 2.4GHz
2.4GHz < f P 3.0GHz
3.0GHz < f P 6.0GHz
CC
A
= +25NC.) (Note 3)
+ 0.3V)
CC
CONDITIONS
Junction-to-Ambient Thermal Resistance (B
Operating Temperature Range ............................. 0NC to +70NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -55NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
20-Pin TQFN .................................................................39NC/W
BA = BB = V
BA = BB = GND
L
= 50I on each output, T
CC
MIN
3.0
85
85
A
= 0NC to +70NC, unless other-
TYP
0.35
100
100
100
85
JA
) (Note 2)
MAX
130
100
115
115
-18
-14
-10
3.6
-8
-8
-1
-6
-5
-5
-5
-5
-1
2
UNITS
mA
mA
dB
dB
I
I
V