MC100EP016AFA ON Semiconductor, MC100EP016AFA Datasheet - Page 12
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MC100EP016AFA
Manufacturer Part Number
MC100EP016AFA
Description
Counter Shift Registers 3.3V/5V ECL 8-Bit
Manufacturer
ON Semiconductor
Datasheet
1.MC100EP016AFA.pdf
(13 pages)
Specifications of MC100EP016AFA
Product Category
Counter Shift Registers
Counter Type
Binary
Counting Sequence
Up
Number Of Circuits
1
Package / Case
LQFP-32
Logic Family
ECL
Logic Type
ECL
Number Of Input Lines
8
Propagation Delay Time
0.7 ns
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
- 40 C
Function
Counter
Mounting Style
SMD/SMT
Number Of Output Lines
8
Operating Supply Voltage
- 3.3 V, + 3.3 V
Factory Pack Quantity
250
Supply Voltage - Max
3.6 V, 3.6 V
Supply Voltage - Min
3 V, 3 V
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC100EP016AFA
Manufacturer:
VISHAY
Quantity:
18 863
Company:
Part Number:
MC100EP016AFAG
Manufacturer:
ON Semiconductor
Quantity:
1
Company:
Part Number:
MC100EP016AFAG
Manufacturer:
ON Semiconductor
Quantity:
10 000
Company:
Part Number:
MC100EP016AFAR2
Manufacturer:
ON Semiconductor
Quantity:
10 000
Company:
Part Number:
MC100EP016AFAR2G
Manufacturer:
ON Semiconductor
Quantity:
10 000
Part Number:
MC100EP016AFAR2G
Manufacturer:
ON/安森美
Quantity:
20 000
SEATING
PLANE
9
B
-AB-
-AC-
B1
-T-
8
1
32
9
S1
A1
G
A
S
0.10 (0.004) AC
DETAIL Y
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
CONTROLLING DIMENSION:
MILLIMETER.
DATUM PLANE -AB- IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
DATUMS -T-, -U-, AND -Z- TO BE
DETERMINED AT DATUM PLANE -AB-.
DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE -AC-.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -AB-.
DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
EXACT SHAPE OF EACH CORNER MAY
VARY FROM DEPICTION.
-Z-
25
4X
17
4X
0.20 (0.008)
-U-
0.20 (0.008)
V1
PACKAGE DIMENSIONS
DETAIL AD
V
http://onsemi.com
MC100EP016A
AB
32 LEAD LQFP
CASE 873A-02
AC
T-U
ISSUE C
T-U
12
Z
C
Z
E
P
H
DIM
A1
B1
S1
V1
W
A
B
C
D
E
G
H
K
M
N
P
Q
R
S
V
X
F
J
8X
1.400
0.300
1.350
0.300
0.050
0.090
0.450
0.090
0.150
MILLIMETERS
MIN
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
1
12 REF
M_
_
_
DETAIL AD
W
1.600
0.450
1.450
0.400
0.150
0.200
0.750
0.160
0.250
MAX
5
DETAIL Y
_
0.055
0.012
0.053
0.012
0.002
0.004
0.018
0.004
0.006
MIN
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
1
12 REF
INCHES
_
_
MAX
0.063
0.018
0.057
0.016
0.006
0.008
0.030
0.006
0.010
X
5
_
AE
AE
K
R
Q_
SECTION AE-AE
É É
É É
F
É É É É
METAL
BASE
N
J
D