MAX98307ETE+ Maxim Integrated, MAX98307ETE+ Datasheet - Page 17

• Manufacturer Part Number: MAX98307ETE+
• Description: Audio Amplifiers 3.3W Mono Class D Amplifier
• Manufacturer: Maxim Integrated

Specifications of MAX98307ETE+

• Rohs: yes
• Product: Class-D
• Output Type: Mono
• Output Power: 3.3 W
• Thd Plus Noise: 0.05 %
• Supply Current: 1.85 mA
• Maximum Power Dissipation: 1.667 W
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TQFN-16
• Common Mode Rejection Ratio (min): 65 dB

Class DG multilevel amplifiers provide much better effi-
ciency and thermal performance than a comparable Class
AB or Class G amplifiers. However, the system’s thermal
performance must be considered with realistic expecta-
tions and include consideration of many parameters. This
section examines Class DG multilevel amplifiers using
general examples to illustrate good design practices.
The exposed pad is the primary route of keeping heat
away from the IC. With a bottom-side exposed pad, the
PCB and its copper becomes the primary heatsink for
the Class DG multilevel amplifier. Solder the exposed
pad to a large copper polygon. Add as much copper
as possible from this polygon to any adjacent pin on
the amplifier as well as to any adjacent components,
provided these connections are at the same potential.
These copper paths must be as wide as possible. Each
of these paths contributes to the overall thermal capabili-
ties of the system.
3.3W Mono Class DG Multilevel Audio Amplifier
MAX98307 (TQFN) Applications Information
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Thermal Considerations
Note: All devices operate over the -40°C to +85°C temperature
range.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
The copper polygon to which the exposed pad is
attached should have multiple vias to the opposite side
of the PCB. Make this polygon as large as possible within
the system’s constraints for signal routing.
For the latest application details on WLP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow temperature
profile, as well as the latest information on reliability test-
ing results, refer to Application Note 1891: Wafer-Level
Packaging (WLP) and Its Applications.
MAX98307ETE+
MAX98308EWC+
MAX98307/MAX98308
PART
MAX98308 (WLP) Applications Information
Ordering Information
GAIN SET
External
Internal
PIN-PACKAGE
16 TQFN-EP*
12 WLP