FT240XS-U FTDI, FT240XS-U Datasheet - Page 33
FT240XS-U
Manufacturer Part Number
FT240XS-U
Description
USB Interface IC USB to Parallel FIFO IC SSOP-24
Manufacturer
FTDI
Datasheet
1.FT240XQ-R.pdf
(40 pages)
Specifications of FT240XS-U
Rohs
yes
Tradename
X-Chip
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FT240X USB 8-BIT FIFO IC Datasheet
Version 1.3
FTDI# 259
Document No.: FT_000626 Clearance No.:
9.3 QFN-24 Package Mechanical Dimensions
Figure 9.3 QFN-24 Package Dimensions
The FT240XQ is supplied in a RoHS compliant leadless QFN-24 package - WQFN(X424), with pad size
114x114. The package is lead ( Pb ) free, and uses a ‘green’ compound. The package is fully compliant
with European Union directive 2002/95/EC.
This package is nominally 4.0mm x 4.0mm. The solder pads are on a 0.50mm pitch. The above
mechanical drawing shows the QFN-24 package. All dimensions are in millimetres.
The centre pad on the base of the FT240XQ is internally connected to GND, and the PCB should not have
tracking on the top layer in this area.
The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number.
The code XXXXXXX is the manufacturing LOT code.
Copyright © 2013 Future Technology Devices International Limited
33
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