MAX3891ECB-TD Maxim Integrated, MAX3891ECB-TD Datasheet - Page 7
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MAX3891ECB-TD
Manufacturer Part Number
MAX3891ECB-TD
Description
Serializers & Deserializers - Serdes
Manufacturer
Maxim Integrated
Type
Serializerr
Datasheet
1.MAX3891ECBD.pdf
(12 pages)
Specifications of MAX3891ECB-TD
Data Rate
2.5 Gbit/s
Input Type
LVPECL
Output Type
LVPECL
Number Of Inputs
16
Number Of Outputs
1
Operating Supply Voltage
3 V to 3.6 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
TQFP-64 EP
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage - Max
3.6 V
Supply Voltage - Min
3 V
The adjusted setup (t
requirements become
It is important to bias the MAX3891’s PECL data and
clock IOs appropriately. Figures 3 and 4 show alterna-
tive PECL output termination methods. A circuit that
provides 50Ω to (V
tion with controlled impedance transmission lines for
proper termination. Use Thevenin equivalent termina-
tion when a (V
coupling is necessary, make sure that the coupling
capacitor follows the 50Ω or Thevenin equivalent DC
termination. To ensure best performance, the differen-
tial outputs (SDO± and PCLKO±) must have balanced
loads.
The system loopback outputs (SLBO) of the MAX3891
are CML compatible. The configuration of the MAX3891
current-mode logic (CML) output circuit includes inter-
nal 50Ω back termination to V
outputs are intended to drive a terminated 50Ω trans-
mission line.
PECL Input and Output Terminations
t
SUADJ
16:1 Serializer,3.3V, 2.5Gbps, SDH/SONET,
CC
(or t
with Clock Synthesis and LVPECL Inputs
_______________________________________________________________________________________
- 2V) supply is not available. If AC-
CC
Current-Mode Logic Outputs
HADJ
- 2V) should be used in conjunc-
SUADJ
) = t
SU
) and hold-time (t
(or t
CC
(Figure 5). These
H
) + t
DEG
HADJ
)
For best performance, use good high-frequency layout
techniques. Filter voltage supplies and keep ground
connections short. Use multiple vias where possible.
Use controlled impedance transmission lines to inter-
face with the MAX3891 clock and data inputs and out-
puts.
The 64-pin exposed pad (EP) TQFP incorporates fea-
tures that provide a very low thermal-resistance path for
heat removal. The MAX3891 EP must be soldered
directly to a ground plane with good thermal conduc-
tance.
TRANSISTOR COUNT: 1712
PROCESS: Bipolar
Exposed Pad Package
Chip Information
Layout Techniques
7