MC100EPT26DTR2 ON Semiconductor, MC100EPT26DTR2 Datasheet - Page 3

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MC100EPT26DTR2

Manufacturer Part Number
MC100EPT26DTR2
Description
IC XLATOR LVPECL-LVTTL 8-TSSOP
Manufacturer
ON Semiconductor
Series
100EPTr
Datasheet

Specifications of MC100EPT26DTR2

Logic Function
Translator
Number Of Bits
1
Input Type
LVPECL, LVDS
Output Type
LVTTL
Number Of Channels
1
Number Of Outputs/channel
1
Differential - Input:output
Yes/No
Propagation Delay (max)
1.8ns
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-TSSOP
Supply Voltage
3 V ~ 3.6 V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Data Rate
-
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
3. Input parameters vary 1:1 with V
4. V
Table 3. MAXIMUM RATINGS
Table 4. PECL INPUT DC CHARACTERISTICS
Symbol
Symbol
V
V
I
T
T
q
q
q
q
q
T
q
V
V
V
V
I
I
BB
IH
IL
A
stg
JA
JC
JA
JC
JA
sol
JC
CC
IN
IH
IL
BB
IHCMR
differential input signal.
IHCMR
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
min varies 1:1 with GND, V
Positive Power Supply
Input Voltage
V
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Wave Solder
Thermal Resistance (Junction−to−Case)
Input HIGH Voltage (Single−Ended)
Input LOW Voltage (Single−Ended)
Output Voltage Reference
Input HIGH Voltage Common Mode
Range (Differential) (Note 4)
Input HIGH Current
Input LOW Current
BB
Sink/Source
Characteristic
Parameter
CC
.
IHCMR
Pb−Free
max varies 1:1 with V
D
D
Pb
V
2075
1355
1775
−150
−150
CC
Min
1.2
http://onsemi.com
GND = 0 V
GND = 0 V
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
(Note 2)
= 3.3 V; GND = 0.0 V (Note 3)
Condition 1
−40°C
1875
Typ
3
CC
. The V
2420
1675
1975
Max
150
3.3
IHCMR
2075
1355
1775
−150
−150
V
SOIC−8
SOIC−8
SOIC−8
TSSOP−8
TSSOP−8
TSSOP−8
DFN8
DFN8
DFN8
Min
1.2
I
 V
range is referenced to the most positive side of the
Condition 2
CC
25°C
1875
Typ
2420
1675
1975
Max
150
3.3
2075
1355
1775
−150
−150
Min
1.2
−65 to +150
−40 to +85
41 to 44
41 to 44
35 to 40
0 to 3.8
Rating
± 0.5
190
130
185
140
129
265
265
3.8
84
85°C
1875
Typ
2420
1675
1975
Max
150
3.3
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
mA
°C
°C
°C
V
V
Unit
mV
mV
mA
mA
V
V

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