MC10H601FNG ON Semiconductor, MC10H601FNG Datasheet - Page 5

IC TRANSLATR 9BIT ECL-TTL 28PLCC

MC10H601FNG

Manufacturer Part Number
MC10H601FNG
Description
IC TRANSLATR 9BIT ECL-TTL 28PLCC
Manufacturer
ON Semiconductor
Series
10Hr
Datasheet

Specifications of MC10H601FNG

Logic Function
Translator
Number Of Bits
9
Input Type
ECL
Output Type
TTL
Number Of Channels
1
Number Of Outputs/channel
9
Differential - Input:output
No/No
Propagation Delay (max)
4.8ns
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
0°C ~ 85°C
Package / Case
28-PLCC
Supply Voltage
4.5 V ~ 5.5 V
Logic Type
Translator
Logic Family
ECL
Translation
ECL to TTL
Propagation Delay Time
9.6 ns
Supply Voltage (max)
- 5.46 V, + 5.5 V
Supply Voltage (min)
- 4.94 V, + 4.5 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Logical Function
Translator
Technology
ECL
High Level Output Current
-15mA
Low Level Output Current
48mA
Operating Supply Voltage (typ)
-5.2/5V
Package Type
PLCC
Operating Supply Voltage (max)
-5.46/5.5V
Operating Supply Voltage (min)
-4.94/4.5V
Abs. Propagation Delay Time
15ns
Mounting
Surface Mount
Pin Count
28
Operating Temperature (min)
0C
Operating Temperature (max)
85C
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Rate
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MC10H601FNGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC10H601FNG
Manufacturer:
ON Semiconductor
Quantity:
135
Part Number:
MC10H601FNG
Manufacturer:
ON Semiconductor
Quantity:
45
Part Number:
MC10H601FNG
Manufacturer:
ON Semiconductor
Quantity:
10 000
−L−
C
0.010 (0.250)
28
Z
G1
S
G
T
1
−N−
L−M
NOTES:
S
1. DATUMS −L−, −M−, AND −N− DETERMINED
2. DIMENSION G1, TRUE POSITION TO BE
3. DIMENSIONS R AND U DO NOT INCLUDE
4. DIMENSIONING AND TOLERANCING PER
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
7. DIMENSION H DOES NOT INCLUDE DAMBAR
V
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
MEASURED AT DATUM −T−, SEATING PLANE.
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
ANSI Y14.5M, 1982.
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
N
A
R
S
J
E
−M−
W
VIEW S
0.007 (0.180)
Y BRK
0.007 (0.180)
D
D
PACKAGE DIMENSIONS
PLASTIC PLCC PACKAGE
−T−
0.004 (0.100)
http://onsemi.com
SEATING
PLANE
CASE 776−02
M
M
FN SUFFIX
PLCC−28
ISSUE E
T
T
L−M
L−M
5
S
S
B
Z
N
N
DIM
G1
K1
W
A
B
C
G
H
K
R
U
E
F
J
V
X
Y
Z
S
VIEW D−D
S
U
X
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
0.410
0.040
0.007 (0.180)
MIN
−−−
K
0.050 BSC
2
INCHES
_
0.007 (0.180)
0.495
0.495
0.180
0.019
0.032
0.456
0.456
0.048
0.048
0.056
0.020
0.430
0.110
MAX
VIEW S
−−−
−−−
10
−−−
_
H
12.32
12.32
10.42
M
11.43
11.43
MILLIMETERS
MIN
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
−−−
1.27 BSC
2
G1
_
T
F
M
L−M
12.57
12.57
11.58
11.58
10.92
MAX
4.57
2.79
0.48
0.81
1.21
1.21
1.42
0.50
−−−
−−−
10
−−−
0.007 (0.180)
T
K1
_
0.010 (0.250)
S
0.007 (0.180)
L−M
N
S
S
N
M
S
S
M
T
T
T
L−M
L−M
L−M
S
S
S
N
N
N
S
S
S

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