M24C64-RDW6T STMicroelectronics, M24C64-RDW6T Datasheet - Page 5

• Manufacturer Part Number: M24C64-RDW6T
• Description: EEPROM 5.5V 64K (8Kx8)
• Manufacturer: STMicroelectronics

Specifications of M24C64-RDW6T

• Product Category: EEPROM
• Memory Size: 64 Kbit
• Organization: 8 K x 8
• Data Retention: 40 yr
• Maximum Clock Frequency: 0.4 MHz
• Maximum Operating Current: 0.8 mA
• Operating Supply Voltage: 1.8 V, 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TSSOP-8
• Access Time: 900 ns
• Interface Type: I2C
• Minimum Operating Temperature: - 40 C
• Factory Pack Quantity: 4000
• Supply Voltage - Max: 5.5 V
• Supply Voltage - Min: 1.8 V

M24C64-W M24C64-R M24C64-F M24C64-DF
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8-pin package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5-bump WLCSP connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
8-bump thin WLCSP connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
I
Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 16
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Maximum R
an I
Maximum R
an I
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
TSSOP8 – 8-lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 33
SO8N – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . . . . . . 34
PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 35
UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package outline . . . . . . . 36
WLCSP-R 5-bump wafer-length chip-scale package outline . . . . . . . . . . . . . . . . . . . . . . . 37
Thin WLCSP 8-bump wafer-length chip-scale package outline . . . . . . . . . . . . . . . . . . . . . 38
2
C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2
2
C bus at maximum frequency f
C bus at maximum frequency f
bus
bus
value versus bus parasitic capacitance (C
value versus bus parasitic capacitance C
Doc ID 16891 Rev 27
C
C
= 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
= 1MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
bus
bus
) for
) for
List of figures
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