AT24C128C-XHM-B Atmel, AT24C128C-XHM-B Datasheet - Page 20

• Manufacturer Part Number: AT24C128C-XHM-B
• Description: EEPROM SERIAL EEPROM 128K (16K x 8) 2WIRE 1.7V
• Manufacturer: Atmel

Specifications of AT24C128C-XHM-B

• Rohs: yes
• Factory Pack Quantity: 100

13.5
8U2-1 — 8-ball VFBGA
Package Drawing Contact:
[e-mail]
Notes:
A1 BALL
PAD
CORNER
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
1. This drawing is for general information.
2. Dimension 'b' is measured at the maximum solder ball diameter.
TOP VIEW
D
d 0.10
8U2-1, 8-ball, 2.35 x 3.73 mm Body, 0.75 mm pitch,
VFBGA Package
TITLE
A
B
E
(4X)
SIDE VIEW
f 0.10 C
C
d 0.08 C
A1
A2
A
j n0.15 m C A B
j n0.08 m C
Øb
Atmel AT24C128C [DATASHEET]
SYMBOL
A
A1
A2
b
D
E
e
e1
d
d1
e
COMMON DIMENSIONS
(Unit of Measure = mm)
(e1)
0.81
0.15
0.40
0.25
MIN
GWW
A1 BALL PAD CORNER
BOTTOM VIEW
GPC
2.35 BSC
3.73 BSC
0.75 BSC
0.74 REF
0.75 BSC
0.80 REF
8 SOLDER BALLS
0.91
0.20
0.45
0.30
NOM
8734B–SEEPR–9/2012
DRAWING NO.
2
1.00
0.25
0.50
0.35
8U2-1
1
MAX
(d1)
d
A
B
C
D
NOTE
3/20/12
REV.
F
20