M24C16-FMN6TP STMicroelectronics, M24C16-FMN6TP Datasheet
M24C16-FMN6TP
Specifications of M24C16-FMN6TP
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M24C16-FMN6TP Summary of contents
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... Kbit (2 Kbytes) of EEPROM – Page size: 16 bytes Single supply voltage: – M24C16-W: 2 5.5 V – M24C16-R: 1 5.5 V – M24C16-F: 1 5.5 V (Read and Write) and 1 5.5 V (Read) Write: – Byte Write within 5 ms – Page Write within 5 ms Operating temperature range: from -40 ° +85 ° ...
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... CC Operating supply voltage Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Minimizing Write delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 17 Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 DocID023494 Rev 2 M24C16-W M24C16-R M24C16-F ...
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... M24C16-W M24C16-R M24C16-F 7 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 10 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 DocID023494 Rev 2 Contents 3/36 ...
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... Memory cell data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 11. DC characteristics (M24C16-W, device grade Table 12. DC characteristics (M24C16-R, device grade Table 13. DC characteristics (M24C16-F, device grade 6 Table 14. 400 kHz AC characteristics Table 15. TSSOP8 – 8-lead thin shrink small outline, package mechanical data Table 16. ...
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... M24C16-W M24C16-R M24C16-F List of figures Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 2. 8-pin package connections, top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3. UFDFPN5 package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 4. WLCSP connections (top view, marking side, with balls on the underside Figure 5. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2 Figure bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 7. Write mode sequences with (data write enabled Figure 8 ...
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... The M24C16-W can be accessed (Read and Write) with a supply voltage from 2 5.5 V, the M24C16-R can be accessed (Read and Write) with a supply voltage from 1 5.5 V, and the M24C16-F can be written with a supply voltage from 1 5.5 V and can be read with a supply voltage from 1 5.5 V. All these devices operate with a clock frequency of 400 kHz (or less), over an ambient temperature range of -40 ° ...
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... M24C16-W M24C16-R M24C16-F 1. See Section 9: Package mechanical data Figure 4. WLCSP connections (top view, marking side, with balls on the underside) Caution: As EEPROM cells lose their charge (and so their binary value) when exposed to ultra violet (UV) light, EEPROM dice delivered in wafer form or in WLCSP package by STMicroelectronics must never be exposed to UV light ...
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... Operating conditions CC CC parameters). In order to secure a stable DC supply voltage line with a suitable capacitor (usually of the order package pins Section 8: DC and AC parameters) DocID023494 Rev 2 M24C16-W M24C16-R M24C16-F (Figure 12 CC voltage operating voltage CC and the rise time must not ...
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... M24C16-W M24C16-R M24C16-F 2.5.3 Device reset In order to prevent inadvertent write operations during power-up, a power-on-reset (POR) circuit is included. At power-up, the device does not respond to any instruction until V internal reset threshold voltage. This threshold is lower than the minimum V voltage (see Operating conditions in over the POR threshold, the device is reset and enters the Standby Power mode; however, ...
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... Memory organization 3 Memory organization The memory is organized as shown below. 10/36 M24C16-W M24C16-R M24C16-F Figure 5. Block diagram DocID023494 Rev 2 ...
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... M24C16-W M24C16-R M24C16-F 4 Device operation The device supports the I data on to the bus is defined transmitter, and any device that reads the data receiver. The device that controls the data transfer is known as the bus master, and the other as the slave device. A data transfer can only be initiated by the bus master, which will also provide the serial clock for synchronization ...
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... The acknowledge bit is used to indicate a successful byte transfer. The bus transmitter, whether it be bus master or slave device, releases Serial Data (SDA) after sending eight bits of data. During the 9 acknowledge the receipt of the eight data bits. 12/36 th clock pulse period, the receiver pulls Serial Data (SDA) low to DocID023494 Rev 2 M24C16-W M24C16-R M24C16-F ...
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... M24C16-W M24C16-R M24C16-F 4.5 Device addressing To start communication between the bus master and the slave device, the bus master must initiate a Start condition. Following this, the bus master sends the device select code, shown in Table 2 (on Serial Data (SDA), most significant bit first). ...
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... During the internal Write cycle, Serial Data (SDA) is disabled internally, and the device does not respond to any requests. If the Write Control input (WC) is driven High, the Write instruction is not executed and the accompanying data bytes are not acknowledged, as shown in 14/36 M24C16-W M24C16-R M24C16-F Figure Table 3. Address byte A5 A4 ...
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... M24C16-W M24C16-R M24C16-F 5.1.1 Byte Write After the device select code and the address byte, the bus master sends one data byte. If the addressed location is Write-protected, by Write Control (WC) being driven high, the device replies with NoAck, and the location is not modified. If, instead, the addressed location is not Write-protected, the device replies with Ack ...
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... Figure 8. Write mode sequences with (data write inhibited) WC Byte Write WC Page Write WC (cont'd) Page Write (cont'd) 16/36 ACK ACK Dev select Byte address Data in R/W ACK ACK Dev select Byte address Data in 1 R/W NO ACK NO ACK Data in N DocID023494 Rev 2 M24C16-W M24C16-R M24C16-F NO ACK NO ACK NO ACK Data in 2 Data in 3 AI02803d ...
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... M24C16-W M24C16-R M24C16-F 5.1.3 Minimizing Write delays by polling on ACK The maximum Write time (t parameters, but the typical time is shorter. To make use of this, a polling sequence can be used by the bus master. The sequence, as shown in Initial condition: a Write cycle is in progress. Step 1: the bus master issues a Start condition followed by a device select code (the first byte of the new instruction) ...
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... Dev select * Byte address Dev select * R/W ACK ACK Dev select Data out 1 R/W ACK ACK Dev select * Byte address Dev select * R/W ACK NO ACK Data out N DocID023494 Rev 2 M24C16-W M24C16-R M24C16-F ACK NO ACK Data out R/W ACK NO ACK Data out N ACK ACK Data out 1 R/W AI01942b ...
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... M24C16-W M24C16-R M24C16-F 5.2.1 Random Address Read A dummy Write is first performed to load the address into this address counter (as shown in Figure 10) but without sending a Stop condition. Then, the bus master sends another Start condition, and repeats the device select code, with the RW bit set to 1. The device acknowledges this, and outputs the contents of the addressed byte ...
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... Positive and negative pulses applied on different combinations of pin connections, according to AEC-Q100-002 (compliant with JEDEC Std JESD22-A114, C1=100 pF, R1=1500 ). 4. 4000 V for devices identified by process letters 20/36 Table 4 may cause permanent damage to Table 4. Absolute maximum ratings Parameter (3) DocID023494 Rev 2 M24C16-W M24C16-R M24C16-F Min. Max. Unit –40 130 °C –65 150 °C ...
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... M24C16-W M24C16-R M24C16 and AC parameters This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. Symbol V Supply voltage CC T Ambient operating temperature A f Operating clock frequency C Symbol V Supply voltage CC T Ambient operating temperature A f Operating clock frequency ...
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... Input impedance (WC Characterized only, not tested in production. Parameter (1) Data retention 1. The data retention behavior is checked in production. The 40-year limit is defined from characterization and qualification results. Table 11. DC characteristics (M24C16-W, device grade 6) Symbol Parameter Input leakage current I LI (SCL, SDA) Output leakage I ...
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... M24C16-W M24C16-R M24C16-F Table 12. DC characteristics (M24C16-R, device grade 6) Symbol Parameter Input leakage current I LI (SCL, SDA) I Output leakage current LO I Supply current (Read Supply current (Write) CC0 I Standby supply current CC1 Input low voltage V IL (SCL, SDA, WC) Input high voltage ...
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... DC and AC parameters Table 13. DC characteristics (M24C16-F, device grade 6) Symbol Parameter Input leakage current I LI (SCL, SDA) I Output leakage current LO I Supply current (Read Supply current (Write) CC0 I Standby supply current CC1 Input low voltage V IL (SCL, SDA, WC) Input high voltage ...
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... M24C16-W M24C16-R M24C16-F Symbol Alt SCL t t CHCL HIGH t t CLCH LOW ( QL1QL2 XH1XH2 XL1XL2 DXCX SU:DAT t t CLDX HD:DAT ( CLQX DH ( CLQV CHDL SU:STA t t DLCL HD:STA t t CHDH SU:STO t t DHDL ...
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... DC and AC parameters Figure 12. Maximum R 26/36 value versus bus parasitic capacitance (C bus bus at maximum frequency f Figure 13. AC waveforms DocID023494 Rev 2 M24C16-W M24C16-R M24C16-F ) for bus = 400 kHz C ...
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... M24C16-W M24C16-R M24C16-F 9 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. Figure 14. TSSOP8 – 8-lead thin shrink small outline, package outline 1. Drawing is not to scale. Table 15. TSSOP8 – ...
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... DocID023494 Rev 2 M24C16-W M24C16-R M24C16 45˚ c 0.25 mm GAUGE PLANE (1) inches Typ Min – – – 0.0039 – 0.0492 – 0.0110 – ...
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... M24C16-W M24C16-R M24C16-F Figure 16. PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package outline 1. Drawing is not to scale. Table 17. PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package mechanical data Symbol Values in inches are converted from mm and rounded to four decimal digits. ...
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... DocID023494 Rev 2 M24C16-W M24C16-R M24C16 must not be SS (1) inches Typ Min Max 0.0217 0.0177 0.0236 0.0008 0.0000 0.0020 0.0098 0.0079 0.0118 0.0787 0.0748 0.0827 – ...
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... M24C16-W M24C16-R M24C16-F Figure 18. UFDFPN5 (MLP5) – package outline (UFDFPN: Ultra thin Fine pitch D Pin 1 Top view (marking side the bottom side, pin 1 is identified by the specific pad shape and, on the top side, pin 1 is defined from the orientation of the marking: when reading the marking, pin 1 is below the upper left package corner. ...
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... Package mechanical data 1. Drawing is not to scale. 32/36 Figure 19. WLCSP 5 bumps package outline DocID023494 Rev 2 M24C16-W M24C16-R M24C16-F ...
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... M24C16-W M24C16-R M24C16-F Symbol (number of terminals) aaa bbb ccc ddd eee 1. Values in inches are converted from mm and rounded to four decimal digits. Table 20. WLCSP 5 bumps package data millimeters Typ Min Max 0.545 0.490 0.600 0.190 – ...
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... Industrial: device tested with standard test flow over – °C Option blank = standard packing T = Tape and reel packing Plating technology ECOPACK 1. RoHS-compliant (ECOPACK1®) 2. RoHS-compliant and halogen-free (ECOPACK2 34/36 Table 21. Ordering information scheme (2) (2) (2) (2) (2) ® (RoHS compliant) ® ) DocID023494 Rev 2 M24C16-W M24C16-R M24C16-F M24C16 ...
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... Revision history Date 05-Oct-2012 19-Mar-2013 Table 22. Document revision history Revision Initial release resulting from splitting datasheet M24C16 revision 17 as follows: – M24C16-125 datasheet for automotive products (range 3) – M24C16-W M24C16-R M24C16-F (this datasheet) for standard products range Updated in Section 8: DC and AC 1 – ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 36/36 Please Read Carefully: © 2013 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com DocID023494 Rev 2 M24C16-W M24C16-R M24C16-F ...