CAT24C02ZI-G ON Semiconductor, CAT24C02ZI-G Datasheet - Page 15

• Manufacturer Part Number: CAT24C02ZI-G
• Description: EEPROM 2K-Bit I2C Serial
• Manufacturer: ON Semiconductor

Specifications of CAT24C02ZI-G

• Product Category: EEPROM
• Rohs: yes
• Memory Size: 2 Kbit
• Organization: 256 x 8
• Data Retention: 100 yr
• Maximum Clock Frequency: 0.4 MHz
• Maximum Operating Current: 2 mA
• Operating Supply Voltage: 1.8 V , 2.5 V , 3.3 V , 5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: MSOP
• Access Time: 900 ns
• Interface Type: I2C
• Minimum Operating Temperature: - 40 C
• Supply Voltage - Max: 5.5 V
• Supply Voltage - Min: 1.7 V

2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
T
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
D
SEATING
PLANE
5X
0.20
C A B
0.039
PACKAGE DIMENSIONS
1.0
0.037
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
CASE 483−02
J
K
ISSUE H
TSOP−5
15
DETAIL Z
0.074
1.9
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
A
B
C
D
G
H
K
M
J
L
S
inches
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_