CAT24C08C4ATR ON Semiconductor, CAT24C08C4ATR Datasheet - Page 17
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CAT24C08C4ATR
Manufacturer Part Number
CAT24C08C4ATR
Description
EEPROM 8KB I2C SER EEPROM
Manufacturer
ON Semiconductor
Datasheet
1.CAT24C04C4ATR.pdf
(21 pages)
Specifications of CAT24C08C4ATR
Rohs
yes
Memory Size
8 KB
Data Retention
100 yr
Maximum Clock Frequency
400 KHz
Operating Supply Voltage
1.7 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
WLCSP-4
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CAT24C08C4ATR
Manufacturer:
ON Semiconductor
Quantity:
4 000
NOTE 5
0.10
2X
2X
NOTE 4
M
REFERENCE
C
4X
0.05 C
PIN A1
A
0.10 C
0.10 C
0.10 C
DETAIL A
B
b
BOTTOM VIEW
È È
È È
B
A
SIDE VIEW
TOP VIEW
1
E
2
A1
e
A B
A2
e
D
PACKAGE DIMENSIONS
C
A
* Die Coat
(Optional)
SEATING
PLANE
NOTE 3
WLCSP4, 0.84x0.86
http://onsemi.com
CASE 567DC
DETAIL A
ISSUE D
17
A3*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A2
A
PITCH
0.40
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
5. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDERING FOOTPRINT*
* Die Coat (Optional)
Y14.5M, 1994.
THE SPHERICAL CROWNS OF THE CONTACT
BALLS.
OF THE CONTACT BALLS.
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
DIM
A3*
A1
A2
A
D
E
b
e
RECOMMENDED
A1
MILLIMETERS
MIN
0.28
0.08
0.16
DIMENSIONS: MILLIMETERS
0.025 REF
0.23 REF
0.84 BSC
0.86 BSC
0.40 BSC
MAX
0.38
0.12
0.20
0.40
PITCH
4X
PACKAGE
OUTLINE
0.18