CAT24C02WI-GT3JN ON Semiconductor, CAT24C02WI-GT3JN Datasheet - Page 15

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CAT24C02WI-GT3JN

Manufacturer Part Number
CAT24C02WI-GT3JN
Description
EEPROM 2KB I2C SER EEPROM
Manufacturer
ON Semiconductor
Datasheet

Specifications of CAT24C02WI-GT3JN

Product Category
EEPROM
Rohs
yes
2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
T
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
D
SEATING
PLANE
5X
0.20
C A B
0.039
PACKAGE DIMENSIONS
1.0
0.037
0.95
SOLDERING FOOTPRINT*
http://onsemi.com
CASE 483−02
J
K
ISSUE H
TSOP−5
15
DETAIL Z
0.074
1.9
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
A
B
C
D
G
H
K
M
J
L
S
inches
mm
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_

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