74LVC4245AD NXP Semiconductors, 74LVC4245AD Datasheet
74LVC4245AD
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74LVC4245AD Summary of contents
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Octal dual supply translating transceiver; 3-state Rev. 10 — 18 December 2012 1. General description The 74LVC4245A is an octal dual supply translating transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions designed ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range 40 C to +125 C 74LVC4245AD 40 C to +125 C 74LVC4245ADB 40 C to +125 C 74LVC4245APW 40 C to +125 C 74LVC4245ABQ 4. Functional diagram 22 G3 3EN1 2 3EN2 mna452 Fig 1 ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning 74LVC4245A V 1 CC(A) DIR GND 11 GND 12 001aaa349 Fig 3. Pin configuration SO24 and (T)SSOP24 5.2 Pin description Table 2. Pin description Symbol V CC(A) V CC(B) GND DIR A[0:7] B[0:7] OE 74LVC4245A Product data sheet Octal dual supply translating transceiver; 3-state ...
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... NXP Semiconductors 6. Functional description [1] Table 3. Functional table Input OE DIR [ HIGH voltage level LOW voltage level don’t care high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 5. Recommended operating conditions Symbol Parameter V output voltage O T ambient temperature amb t/V input transition rise and fall rate 9. Static characteristics Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter = 40 C to +85 C ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter I additional supply current CC C input capacitance I C input/output capacitance I/O = 40 C to +125 C T amb V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage V ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter I additional supply current CC [1] All typical values are measured at V [2] For transceivers, the parameter 3.6 V: other inputs at V CC( 4 5.5 V: other inputs at V CC(A) 10 ...
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... NXP Semiconductors Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). V Symbol Parameter Conditions t output skew sk(o) time C power 5 V bus An; PD dissipation V = GND capacitance V CC(A outputs enabled outputs disabled 3 V bus Bn GND CC(B outputs enabled outputs disabled ...
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... NXP Semiconductors = 1 2.7 V CC( 0 CC(A) CC(A) V and V are typical output voltage drops that occur with the output load Fig 6. Input (An, Bn) to output (Bn, An) propagation delays OE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH = 1 2.7 V V ...
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... NXP Semiconductors Test data is given in Table R = Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Z T Fig 8. Load circuitry for switching times Table 8. Test data Supply voltage V V CC(A) CC(B) < 2.7 V < 3 ...
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... NXP Semiconductors 12. Package outline SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT340-1 Fig 10 ...
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... NXP Semiconductors TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... NXP Semiconductors 13. Abbreviations Table 9. Abbreviations Acronym Description ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 14. Revision history Table 10. Revision history Document ID Release date 74LVC4245A v.10 20121218 • Modifications: V CC(A 74LVC4245A v.9 20121120 • Modifications: Figure 74LVC4245A v.8 20111122 74LVC4245A v.7 20110812 74LVC4245A v.6 20080118 74LVC4245A v ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... Octal dual supply translating transceiver; 3-state NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 13 Abbreviations ...