74LVC544ADB NXP Semiconductors, 74LVC544ADB Datasheet
74LVC544ADB
Specifications of 74LVC544ADB
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74LVC544ADB Summary of contents
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Octal D-type registered transceiver; inverting; 3-state Rev. 4 — 18 December 2012 1. General description The 74LVC544A is an octal registered inverting transceiver containing two sets of D-type latches for temporary storage of the data flow in either direction. ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 40 C to +125 C 74LVC544AD 40 C to +125 C 74LVC544ADB 40 C to +125 C 74LVC544APW 4. Functional diagram OEBA 13 OEAB 11 EAB ...
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... NXP Semiconductors OEBA EBA LEBA OEAB EAB LEAB An Fig 3. Logic diagram 5. Pinning information 5.1 Pinning Fig 4. Pin configuration for SO24 and (T)SSOP24 74LVC544A Product data sheet Octal D-type registered transceiver; inverting; 3-state identical channels To 7 other channels 1 LEBA OEBA ...
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... NXP Semiconductors 5.2 Pin description Table 2. Pin description Symbol Pin LEBA 1 OEBA EAB 11 GND 12 OEAB 13 LEAB EBA 74LVC544A Product data sheet Octal D-type registered transceiver; inverting; 3-state ...
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... NXP Semiconductors 6. Functional description [1] Table 3. Function table Operating mode Disabled Disabled plus latch Latch plus display Transparent Hold (do nothing) [ for direction and BA for direction H = HIGH voltage level L = LOW voltage level h = HIGH state must be present one set-up time before the LOW-to-HIGH transition of LEAB, LEBA, EAB and EBA l = LOW state must be present one set-up time before the LOW-to-HIGH transition of LEAB, LEBA, EAB and EBA X = don’ ...
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... NXP Semiconductors 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/V input transition rise and fall rate 9. Static characteristics Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions I OFF-state output GND; O current I power-off OFF CC leakage current I supply current I additional per input pin; ...
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... NXP Semiconductors Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter Conditions t enable time OEBA to An; OEAB to Bn; see EBA to An; EAB to Bn; see ...
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... NXP Semiconductors Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter Conditions t output skew 3.6 V sk(o) CC time C power V = GND dissipation capacitance [1] Typical values are measured at T [2] ...
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... NXP Semiconductors LEXX input An, Bn output Measurement points are given in V and V are typical output voltage levels that occur with the output load Fig 6. Latch enable input (LEXX) pulse width and latch enable input to output (An, Bn) propagation delays An, Bn input ...
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... NXP Semiconductors OEXX, EXX input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in V and V are typical output voltage levels that occur with the output load Fig 8. 3-state enable and disable times Table 8. Measurement points ...
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... NXP Semiconductors Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance External voltage for measuring switching times. EXT Fig 9. Load circuitry for switching times Table 9 ...
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... NXP Semiconductors 12. Package outline SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION IEC SOT340-1 Fig 11 ...
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... NXP Semiconductors TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... Revision history Document ID Release date 74LVC544A v.4 20121218 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 74LVC544A v.3 20040511 74LVC544A v.2 19980729 74LVC544A v ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... Octal D-type registered transceiver; inverting; 3-state NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 5 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 13 Abbreviations ...