450-0037R LS Research, 450-0037R Datasheet - Page 27

• Manufacturer Part Number: 450-0037R
• Description: WiFi / 802.11 Modules TiWi-R2 Module, U.FL Conn, Tape and Reel
• Manufacturer: LS Research

Specifications of 450-0037R

• Product Category: WiFi / 802.11 Modules
• Rohs: yes
• Protocol Supported: 802.11 b/g/n, Bluetooth
• Frequency Band: 2.412 GHz to 2.472 GHz, 2.402 GHz to 2.48 GHz
• Data Rate: 65 Mbps
• Interface Type: Bluetooth, SDIO
• Transmit Power (max): 9.5 dBm, 20 dBm
• Antenna Connector Type: u.FL
• Operating Supply Voltage: 1.8 V, 3.6 V
• Maximum Operating Temperature: + 85 C
• Dimensions: 18 mm x 13 mm x 1.9 mm
• Minimum Operating Temperature: - 40 C
• Modulation Technique: CCK, OFDM
• Factory Pack Quantity: 1000

CLEANING
In general, cleaning populated modules is
strongly discouraged. Residuals under the
module cannot be easily removed with any
cleaning process.
OPTICAL INSPECTION
After soldering the Module to the host board,
consider optical inspection to check the
following:
REWORK
The module can be unsoldered from the host
board if the Moisture Sensitivity Level (MSL)
requirements are met as described in this
datasheet.
The information in this document is subject to change without notice.
330-0045-R4.0






Never attempt rework on the module
itself,
components.
terminate warranty coverage.
Cleaning with water can lead to capillary
effects where water is absorbed into the gap
between the host board and the module.
The combination of soldering flux residuals
and encapsulated water could lead to short
circuits between neighboring pads. Water
could also damage any stickers or labels.
Cleaning with alcohol or a similar organic
solvent will likely flood soldering flux
residuals into the RF shield, which is not
accessible for post-washing inspection. The
solvent could also damage any stickers or
labels.
Ultrasonic cleaning could damage the
module permanently.
Proper alignment and centering of the
module over the pads.
Proper solder joints on all pads.
Excessive solder or contacts to neighboring
pads or vias.
e.g.,
replacing
Such actions will
Copyright © 2010-2012 LS Research, LLC
individual
SHIPPING, HANDLING, AND STORAGE
Shipping
TiWi-R2 modules are delivered in trays of 100
or reels of 1,000.
Handling
The TiWi-R2 modules contain a highly sensitive
electronic circuitry. Handling without proper
ESD protection may damage the module
permanently.
Moisture Sensitivity Level (MSL)
Per J-STD-020, devices rated as MSL 4 and
not stored in a sealed bag with desiccant pack
should be baked prior to use.
After opening packaging, devices that will be
subjected to reflow must be mounted within 72
hours of factory conditions (<30°C and 60%
RH) or stored at <10% RH.
Bake devices for 48 hours at 125°C.
Storage
Please use this product within 6 months after
receipt. Any product used after 6 months of
receipt needs to have solderability confirmed
before use.
The product shall be stored without opening the
packing under the ambient temperature from 5 to
35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be
deformed at the temperatures above this range.)
Do not store in salty air or in an environment
with a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX.
Do not store in direct sunlight.
The product should not be subject to excessive
mechanical shock.
TiWi-R2 TRANSCEIVER MODULE
DATASHEET
Page 27 of 41