MC100LVEL16DR2G ON Semiconductor, MC100LVEL16DR2G Datasheet - Page 8

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MC100LVEL16DR2G

Manufacturer Part Number
MC100LVEL16DR2G
Description
IC RECEIVER ECL DIFF 3.3V 8-SOIC
Manufacturer
ON Semiconductor
Series
100LVELr
Datasheet

Specifications of MC100LVEL16DR2G

Logic Type
Differential Receiver
Supply Voltage
3 V ~ 3.8 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Bits
-

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC100LVEL16DR2G
Manufacturer:
HIROSE
Quantity:
12 000
Part Number:
MC100LVEL16DR2G
Manufacturer:
ON/安森美
Quantity:
20 000
0.15 (0.006) T
0.15 (0.006) T
−T−
0.10 (0.004)
SEATING
PLANE
L
U
U
S
S
PIN 1
IDENT
D
2X
L/2
C
8
1
−V−
A
8x
4
5
K
G
0.10 (0.004)
REF
−U−
B
PACKAGE DIMENSIONS
PLASTIC TSSOP PACKAGE
http://onsemi.com
M
T
CASE 948R−02
DT SUFFIX
U
TSSOP−8
DETAIL E
ISSUE A
S
8
DETAIL E
V
S
F
0.25 (0.010)
M
−W−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
5. TERMINAL NUMBERS ARE SHOWN FOR
6. DIMENSION A AND B ARE TO BE DETERMINED
Y14.5M, 1982.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
REFERENCE ONLY.
AT DATUM PLANE -W-.
DIM
A
B
C
D
F
G
K
L
M
MILLIMETERS
MIN
2.90
2.90
0.80
0.05
0.40
0.25
0
0.65 BSC
4.90 BSC
_
MAX
3.10
3.10
1.10
0.15
0.70
0.40
6
_
0.031
0.002
0.016
0.010
0.114
0.114
MIN
0.026 BSC
0.193 BSC
0
INCHES
_
MAX
0.122
0.122
0.043
0.006
0.028
0.016
6
_

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