MC100EP16TDR2G ON Semiconductor, MC100EP16TDR2G Datasheet - Page 3

• Manufacturer Part Number: MC100EP16TDR2G
• Description: IC RCVR/DRVR 5V DIFF ECL 8-SOIC
• Manufacturer: ON Semiconductor
• Series: 100EPr

Specifications of MC100EP16TDR2G

• Logic Type: Differential Receiver/Driver
• Supply Voltage: 3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Bits: -

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
3. Input and output parameters vary 1:1 with V
4. All loading with 50 W to V
5. V
Table 3. MAXIMUM RATINGS
Symbol
Table 4. 10EP DC CHARACTERISTICS, PECL
Symbol
V
V
V
I
I
T
T
q
q
q
q
q
T
q
I
V
V
V
V
V
R
I
I
out
BB
EE
IH
IL
A
stg
JA
JC
JA
JC
JA
sol
JC
CC
EE
I
OH
OL
IH
IL
IHCMR
T
input signal.
IHCMR
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
min varies 1:1 with V
PECL Mode Power Supply
NECL Mode Power Supply
PECL Mode Input Voltage
NECL Mode Input Voltage
Output Current
V
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Wave Solder
Thermal Resistance (Junction−to−Case)
Power Supply Current
Output HIGH Voltage (Note 4)
Output LOW Voltage (Note 4)
Input HIGH Voltage (Single−Ended)
Input LOW Voltage (Single−Ended)
Input HIGH Voltage Common Mode Range
(Differential Configuration) (Note 5)
Internal Termination Resistor
Input HIGH Current
Input LOW Current
BB
Sink/Source
Characteristic
CC
Parameter
EE
− 2.0 V.
, V
IHCMR
max varies 1:1 with V
CC
. V
Pb−Free
EE
V
can vary +0.3 V to −2.2 V.
Pb
CC
http://onsemi.com
2165
1365
2090
1365
−150
Min
2.0
= 3.3 V, V
16
43
V
V
V
V
Continuous
Surge
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
(Note 2)
EE
CC
EE
CC
CC
Condition 1
= 0 V
= 0 V
. The V
= 0 V
= 0 V
−40°C
2290
1490
Typ
23
3
EE
IHCMR
= 0 V (Note 3)
2415
1615
2415
1690
Max
150
3.3
31
57
range is referenced to the most positive side of the differential
2230
1430
2155
1430
−150
Min
2.0
16
43
V
V
SOIC−8
SOIC−8
SOIC−8
TSSOP−8
TSSOP−8
TSSOP−8
DFN8
DFN8
DFN8
I
I
v V
w V
Condition 2
25°C
2355
1555
CC
EE
Typ
23
50
2480
1680
2480
1755
Max
150
3.3
31
57
2290
1490
2215
1490
−150
Min
2.0
16
43
−65 to +150
−40 to +85
41 to 44
41 to 44
35 to 40
Rating
2415
1615
85°C
± 0.5
Typ
100
190
130
185
140
129
265
265
23
−6
−6
50
84
6
6
2540
1740
2540
1815
Max
150
3.3
31
57
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
mA
mA
mA
mA
mV
mV
mV
mV
°C
°C
°C
mA
mA
W
V
V
V
V
V