MCF51JU128VLH Freescale Semiconductor, MCF51JU128VLH Datasheet - Page 30

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MCF51JU128VLH

Manufacturer Part Number
MCF51JU128VLH
Description
32-bit Microcontrollers - MCU ColdFireV1,128kFlash
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MCF51JU128VLH

Rohs
yes
Core
ColdFire V1
Processor Series
MCF51JU128
Data Bus Width
32 bit
Maximum Clock Frequency
50 MHz
Program Memory Size
128 KB
On-chip Adc
Yes
Operating Supply Voltage
1.71 V to 3.6 V
Operating Temperature Range
- 40 C to + 105 C
Package / Case
LQFP-64
Mounting Style
SMD/SMT

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Memories and memory interfaces
1. Typical data retention values are based on measured response accelerated at high temperature and derated to a constant
2. Data retention is based on T
3. Cycling endurance represents number of program/erase cycles at -40°C ≤ T
4. Write endurance represents the number of writes to each FlexRAM location at -40°C ≤Tj ≤ 125°C influenced by the cycling
6.4.1.5 Write endurance to FlexRAM for EEPROM
When the FlexNVM partition code is not set to full data flash, the EEPROM data set size
can be set to any of several non-zero values.
The bytes not assigned to data flash via the FlexNVM partition code are used by the
FTFL to obtain an effective endurance increase for the EEPROM data. The built-in
EEPROM record management system raises the number of program/erase cycles that can
be attained prior to device wear-out by cycling the EEPROM data through a larger
EEPROM NVM storage space.
While different partitions of the FlexNVM are available, the intention is that a single
choice for the FlexNVM partition code and EEPROM data set size is used throughout the
entire lifetime of a given application. The EEPROM endurance equation and graph
shown below assume that only one configuration is ever used.
Writes_FlexRAM =
where
30
n
n
n
n
n
nvmwree128
nvmwree512
Symbol
nvmwree16
nvmwree4k
nvmwree8k
• Writes_FlexRAM — minimum number of writes to each FlexRAM location
• EEPROM — allocated FlexNVM based on DEPART; entered with Program
• EEESIZE — allocated FlexRAM based on DEPART; entered with Program Partition
• Write_efficiency —
25°C use profile. Engineering Bulletin EB618 does not apply to this technology.
endurance of the FlexNVM (same value as data flash) and the allocated EEPROM backup. Minimum and typical values
assume all byte-writes to FlexRAM.
Partition command
command
Write endurance
Description
• EEPROM backup to FlexRAM ratio = 16
• EEPROM backup to FlexRAM ratio = 128
• EEPROM backup to FlexRAM ratio = 512
• EEPROM backup to FlexRAM ratio = 4096
• EEPROM backup to FlexRAM ratio = 8192
Table 19. NVM reliability specifications (continued)
EEPROM – 2 × EEESIZE
javg
= 55°C (temperature profile over the lifetime of the application).
EEESIZE
MCF51JU128 Data Sheet, Rev. 4, 01/2012.
× Write_efficiency × n
1.27 M
315 K
10 M
20 M
35 K
Min.
100 M
175 K
1.6 M
6.4 M
Typ.
50 M
j
≤ 125°C.
1
nvmcycd
Max.
Freescale Semiconductor, Inc.
writes
writes
writes
writes
writes
Unit
Notes
4

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