MAX1248BEPE Maxim Integrated, MAX1248BEPE Datasheet - Page 14

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MAX1248BEPE

Manufacturer Part Number
MAX1248BEPE
Description
Analog to Digital Converters - ADC Integrated Circuits (ICs)
Manufacturer
Maxim Integrated
Datasheet

Specifications of MAX1248BEPE

Number Of Channels
4/2
Architecture
SAR
Conversion Rate
133 KSPs
Resolution
10 bit
Input Type
Single-Ended/Differential
Snr
66 dB
Interface Type
4-Wire (SPI, Microwire, QSPI, TMS320)
Operating Supply Voltage
2.7 V to 5.25 V
Maximum Operating Temperature
+ 85 C
Package / Case
PDIP N
Maximum Power Dissipation
667 mW
Minimum Operating Temperature
- 40 C
Number Of Converters
1
Factory Pack Quantity
25
Voltage Reference
2.5 V
+2.7V to +5.25V, Low-Power, 4-Channel,
Serial 10-Bit ADCs in QSOP-16
Figure 10a. External Clock Mode, 15 Clocks/Conversion Timing
Figure 10b. External Clock Mode, 16 Clocks/Conversion Timing
Float SHDN to select external compensation. The
Typical Operating Circuit uses a 4.7µF capacitor at
VREF. A value of 4.7µF or greater ensures reference-
buffer stability and allows converter operation at the
2MHz full clock speed. External compensation increas-
es power-up time (see Choosing Power-Down Mode
and Table 4).
Pull SHDN high to select internal compensation.
Internal compensation requires no external capacitor at
VREF and allows for the shortest power-up times. The
maximum clock rate is 2MHz in internal clock mode
and 400kHz in external clock mode.
You can save power by placing the converter in a low-
current shutdown state between conversions. Select full
power-down or fast power-down mode via bits 1 and 0
of the DIN control byte with SHDN high or floating
(Tables 1 and 5). In both software power-down modes,
the serial interface remains operational, but the ADC
does not convert. Pull SHDN low at any time to shut
down the converter completely. SHDN overrides bits 1
and 0 of the control byte.
14
DOUT
SCLK
DIN
SSTRB
CS
DOUT
SCLK
DIN
______________________________________________________________________________________
CS
S
CONTROL BYTE 0
S
1
Choosing Power-Down Mode
CONTROL BYTE 0
8
B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 S1 S0
B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 S1 S0
CONVERSION RESULT 0
CONVERSION RESULT 0
S
1
Full power-down mode turns off all chip functions that
draw quiescent current, reducing supply current typically
to 2µA. Fast power-down mode turns off all circuitry
except the bandgap reference. With fast power-down
mode, the supply current is 30µA. Power-up time can be
shortened to 5µs in internal compensation mode.
Table 4 shows how the choice of reference-buffer com-
pensation and power-down mode affects both power-up
delay and maximum sample rate. In external compensa-
tion mode, power-up time is 20ms with a 4.7µF compen-
sation capacitor when the capacitor is initially fully
discharged. From fast power-down, start-up time can be
eliminated by using low-leakage capacitors that do not
discharge more than 1/2LSB while shut down. In power-
down, leakage currents at VREF cause droop on the ref-
erence bypass capacitor. Figures 11a and 11b show
the various power-down sequences in both external and
internal clock modes.
CONTROL BYTE 1
S
CONTROL BYTE 1
8
B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 S1 S0
CONVERSION RESULT 1
CONVERSION RESULT 1
B9
S
1
B8
CONTROL BYTE 2
B7 B6

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