MC10H116DG ON Semiconductor, MC10H116DG Datasheet - Page 5
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MC10H116DG
Manufacturer Part Number
MC10H116DG
Description
IC RECEIVER TRPL LINE ECL 16SOIC
Manufacturer
ON Semiconductor
Series
10Hr
Datasheet
1.MC10H116MEL.pdf
(6 pages)
Specifications of MC10H116DG
Number Of Drivers/receivers
*
Protocol
*
Mounting Type
Surface Mount
Package / Case
16-SOIC (3.9mm Width)
Operating Temperature
0°C ~ 75°C
Logic Type
Line Receiver
Number Of Bits
*
Logic Family
10H
Supply Voltage (max)
- 5.46 V
Supply Voltage (min)
- 4.94 V
Maximum Operating Temperature
75 C
Mounting Style
SMD/SMT
Maximum Power Dissipation
85 mW
Minimum Operating Temperature
0 C
Number Of Lines (input / Output)
/ /
Supply Current
21 mA
Number Of Receivers
3
Number Of Transmitters
Not Required
Number Of Transceivers
Not Required
Receiver Signal Type
Differential
Transmitter Signal Type
Not Required
Single Supply Voltage (typ)
-5.2V
Single Supply Voltage (min)
-4.94V
Single Supply Voltage (max)
-5.46V
Dual Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Power Supply Requirement
Single
Operating Temp Range
0C to 75C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
16
Package Type
SOIC
Supply Voltage Range
4.94V To 5.46V
Filter Terminals
SMD
Driver Case Style
SOIC
No. Of Pins
16
Operating Temperature Range
0°C To +75°C
Rohs Compliant
Yes
Family Type
ECL
Input Type
ECL/HSTL
Leaded Process Compatible
Yes
Logic Base Number
H116
Logic Case Style
SOIC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Supply Voltage
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MC10H116DGOS
C
16
K
1
N
B
B
H
−A−
16
G
1
E
F
F
D
9
8
16 PL
A
0.25 (0.010)
B
S
G
0.25 (0.010)
K
C
M
−T−
9
8
T
M
16X
A
T
SEATING
PLANE
PACKAGE DIMENSIONS
M
CERAMIC DIP PACKAGE
D
PLASTIC DIP PACKAGE
A
T
A
http://onsemi.com
SEATING
PLANE
CASE 620A−01
J
CASE 648−08
L
L SUFFIX
P SUFFIX
CDIP−16
ISSUE O
PDIP−16
ISSUE R
5
0.25 (0.010)
L
M
16X
M
T
M
J
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
Y14.5M, 1982.
FORMED PARALLEL.
DIM
M
A
B
C
D
G
H
K
S
F
J
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
5 THIS DRAWING REPLACES OBSOLETE
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295
0.020
MIN
0.100 BSC
0.050 BSC
ASME Y14.5M, 1994.
FORMED PARALLEL.
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
CASE OUTLINE 620−10.
0
INCHES
DIM
_
A
B
C
D
G
H
K
M
N
E
F
L
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MAX
0.70
0.750
0.240
0.015
0.055
0.008
0.125
0.020
10
MIN
−−−
0.050 BSC
0.100 BSC
0.300 BSC
_
0
INCHES
_
18.80
MILLIMETERS
MIN
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
0.785
0.295
0.200
0.020
0.065
0.015
0.170
0.040
MAX
2.54 BSC
1.27 BSC
0
15
_
_
19.55
MAX
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
19.05
10
MILLIMETERS
MIN
6.10
0.39
1.40
0.21
3.18
0.51
−−−
1.27 BSC
2.54 BSC
7.62 BSC
0
_
_
19.93
MAX
7.49
5.08
0.50
1.65
0.38
4.31
1.01
15
_