MC10H116FNG ON Semiconductor, MC10H116FNG Datasheet - Page 4

• Manufacturer Part Number: MC10H116FNG
• Description: IC LINE RCVR TRIPLE ECL 20PLCC
• Manufacturer: ON Semiconductor
• Series: 10Hr

Specifications of MC10H116FNG

• Number Of Drivers/receivers: *
• Protocol: *
• Mounting Type: Surface Mount
• Package / Case: 20-PLCC
• Operating Temperature: 0°C ~ 75°C
• Logic Type: Line Receiver
• Number Of Bits: *
• Logic Family: 10H
• Supply Voltage (max): - 5.46 V
• Supply Voltage (min): - 4.94 V
• Maximum Operating Temperature: 75 C
• Mounting Style: SMD/SMT
• Maximum Power Dissipation: 85 mW
• Minimum Operating Temperature: 0 C
• Number Of Lines (input / Output): / /
• Supply Current: 21 mA
• Msl: MSL 3 - 168 Hours
• Supply Voltage Range: -4.94V To -5.46V
• Filter Terminals: SMD
• Driver Case Style: LCC
• No. Of Pins: 20
• Rohs Compliant: Yes
• Family Type: ECL
• Input Type: ECL/HSTL
• Leaded Process Compatible: Yes
• Logic Base Number: H116
• Logic Case Style: LCC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Supply Voltage: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

C
−L−
0.010 (0.250)
20
Z
G1
S
G
T
1
−N−
L−M
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
7. DIMENSION H DOES NOT INCLUDE DAMBAR
1982.
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
DATUM −T−, SEATING PLANE.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
S
A
R
V
N
VIEW S
−M−
S
E
Y BRK
J
0.007 (0.180)
0.007 (0.180)
−T−
W
0.004 (0.100)
SEATING
PLANE
M
M
PACKAGE DIMENSIONS
D
D
T
T
L−M
L−M
http://onsemi.com
20 LEAD PLLC
CASE 775−02
S
S
ISSUE E
B
N
N
Z
S
S
4
VIEW D−D
U
0.007 (0.180)
K1
X
0.007 (0.180)
K
DIM
G1
K1
W
G
A
B
C
E
F
H
J
K
R
U
V
X
Y
Z
M
0.385
0.385
0.165
0.090
0.013
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
0.310
0.040
MIN
T
VIEW S
−−−
0.050 BSC
2
INCHES
_
L−M
M
0.395
0.395
0.180
0.019
0.032
0.356
0.356
0.048
0.048
0.056
0.020
0.330
0.110
G1
MAX
T
−−−
−−−
10
−−−
S
L−M
_
F
H
N
MILLIMETERS
S
9.78
9.78
4.20
2.29
0.33
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
7.88
1.02
0.010 (0.250)
MIN
S
−−−
1.27 BSC
2
_
0.007 (0.180)
N
0.007 (0.180)
10.03
10.03
S
MAX
4.57
2.79
0.48
0.81
9.04
9.04
1.21
1.21
1.42
0.50
8.38
−−−
−−−
10
−−−
_
S
T
M
M
L−M
T
T
L−M
L−M
S
S
N
S
S
N
N
S
S