MC10H115FNG ON Semiconductor, MC10H115FNG Datasheet - Page 5

IC RECEIVER QUAD LINE ECL 20PLCC

MC10H115FNG

Manufacturer Part Number
MC10H115FNG
Description
IC RECEIVER QUAD LINE ECL 20PLCC
Manufacturer
ON Semiconductor
Series
10Hr
Datasheet

Specifications of MC10H115FNG

Number Of Drivers/receivers
*
Protocol
*
Mounting Type
Surface Mount
Package / Case
20-PLCC
Operating Temperature
0°C ~ 75°C
Logic Type
Line Receiver
Number Of Bits
*
Logic Family
10H
Number Of Receivers
4
Receiver Signal Type
Differential
Operating Supply Voltage
- 8 V to 0 V
Maximum Operating Temperature
75 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Supply Voltage
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MC10H115FNGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC10H115FNG
Manufacturer:
ON Semiconductor
Quantity:
10 000
e
C
16
1
0.13 (0.005)
K
N
B
B
Z
b
D
M
16
1
E
9
8
F
A
A
E
0.10 (0.004)
A
H
1
G
0.25 (0.010)
E
VIEW P
9
8
PACKAGE DIMENSIONS
M
16X
CERAMIC DIP PACKAGE
M
T
_
http://onsemi.com
L
D
A
E
A
T
CASE 620A−01
CASE 966−01
SOEIAJ−16
SEATING
PLANE
L SUFFIX
CDIP−16
ISSUE O
ISSUE A
L
DETAIL P
L
5
0.25 (0.010)
Q
1
c
16X
M
T
M
J
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. TERMINAL NUMBERS ARE SHOWN FOR
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
Y14.5M, 1982.
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
H
DIM
A
L
M
A
b
c
D
E
e
L
Q
Z
E
E
1
1
NOTES:
MILLIMETERS
MIN
0.05
0.35
0.10
9.90
5.10
7.40
0.50
0.70
1.10
−−−
−−−
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
5 THIS DRAWING REPLACES OBSOLETE
0
1.27 BSC
_
ASME Y14.5M, 1994.
FORMED PARALLEL.
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
CASE OUTLINE 620−10.
DIM
M
A
B
C
D
E
F
G
H
K
L
N
10.50
MAX
10
2.05
0.20
0.50
0.20
5.45
8.20
0.85
1.50
0.90
0.78
_
0.750
0.240
0.015
0.055
0.008
0.125
0.020
MIN
−−−
0.050 BSC
0.100 BSC
0.300 BSC
0
INCHES
_
0.002
0.014
0.007
0.390
0.201
0.291
0.020
0.043
0.028
MIN
−−−
−−−
0.050 BSC
0
INCHES
_
0.785
0.295
0.200
0.020
0.065
0.015
0.170
0.040
MAX
15
_
0.081
0.008
0.020
0.413
0.215
0.323
0.033
0.059
0.035
0.031
MAX
0.011
10
_
19.05
MILLIMETERS
MIN
6.10
0.39
1.40
0.21
3.18
0.51
−−−
1.27 BSC
2.54 BSC
7.62 BSC
0
_
19.93
MAX
7.49
5.08
0.50
1.65
0.38
4.31
1.01
15
_

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