MC10H174PG ON Semiconductor, MC10H174PG Datasheet

IC MUX DUAL 4:1 ECL 16-DIP

MC10H174PG

Manufacturer Part Number
MC10H174PG
Description
IC MUX DUAL 4:1 ECL 16-DIP
Manufacturer
ON Semiconductor
Series
10Hr
Type
Multiplexerr
Datasheet

Specifications of MC10H174PG

Circuit
2 x 4:1
Independent Circuits
1
Voltage Supply Source
Dual Supply
Voltage - Supply
4.94 V ~ 5.46 V
Operating Temperature
0°C ~ 75°C
Mounting Type
Through Hole
Package / Case
16-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Output High, Low
-
MC10H174
Dual 4 to 1 Multiplexer
Description
functional/ pinout duplication of the standard MECL 10K™ part, with
100% improvement in propagation delay and no increase in power
supply current.
Features
*For additional information on our Pb−Free strategy and soldering details, please
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 8
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
The MC10H174 is a Dual 4−to−1 Multiplexer. This device is a
temperature range)
Propagation Delay, 1.5 ns Typical
Power Dissipation, 305 mW Typical
Improved Noise Margin 150 mV (over operating voltage and
Voltage Compensated
MECL 10K Compatible
Pb−Free Packages are Available*
1
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
16
20 1
*For additional marking information, refer to
CASE 620A
SOEIAJ−16
FN SUFFIX
Application Note AND8002/D.
CASE 648
CASE 966
CASE 775
1
P SUFFIX
L SUFFIX
PLLC−20
CDIP−16
PDIP−16
A
WL, L
YY, Y
WW, W = Work Week
G
ORDERING INFORMATION
http://onsemi.com
= Assembly Location
= Wafer Lot
= Year
= Pb−Free Package
16
MARKING DIAGRAMS*
1
Publication Order Number:
16
1
MC10H174L
AWLYYWW
AWLYYWW
AWLYYWWG
MC10H174P
10H174G
ALYWG
10H174
1 20
MC10H174/D

Related parts for MC10H174PG

MC10H174PG Summary of contents

Page 1

... MECL 10K Compatible • Pb−Free Packages are Available* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 8 http://onsemi.com MARKING DIAGRAMS* CDIP− ...

Page 2

... If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected PIN 1 CC1 V = PIN 16 CC2 V = PIN 8 EE For PLCC pin assignment, see the Pin Conversion Tables on page the ON Semiconductor MECL Data Book (DL122/D). TRUTH TABLE ENABLE ADDRESS INPUTS OUTPUTS ...

Page 3

... MC10H174FN MC10H174FNG MC10H174FNR2 MC10H174FNR2G MC10H174L MC10H174M MC10H174MG MC10H174MEL MC10H174MELG MC10H174P MC10H174PG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/ −5.2 V ±5%) (Note 1) EE 0° 25° Min Max Min − ...

Page 4

Y BRK −L− −M− 0.007 (0.180) Z 0.007 (0.180 −T− J VIEW S G1 0.010 (0.250) T L− NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, ...

Page 5

VIEW 0.10 (0.004) 0.13 (0.005 0.25 (0.010) PACKAGE DIMENSIONS SOEIAJ−16 CASE 966−01 ISSUE ...

Page 6

... American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. ...

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