ENW-89820A3KF Panasonic Electronic Components, ENW-89820A3KF Datasheet - Page 2

• Manufacturer Part Number: ENW-89820A3KF
• Description: Bluetooth / 802.15.1 Modules PAN1720 CC2540 BLE 8051 Ctrlr BR FW
• Manufacturer: Panasonic Electronic Components

Specifications of ENW-89820A3KF

• Product Category: Bluetooth / 802.15.1 Modules
• Rohs: yes
• Class: 2
• Frequency Band: 2.4 GHz
• Sensitivity: - 96 dBm
• Data Rate: 1 Mbps
• Operating Supply Voltage: 2 to 3.6 V
• Output Power: 4 dBm
• Interface Type: SPI, UART, USB
• Maximum Operating Temperature: + 85 C
• Dimensions: 14.5 mm x 8.2 mm x 3 mm
• Minimum Operating Temperature: - 40 C
• Factory Pack Quantity: 500

CLASSIFICATION
SUBJECT
CUSTOMER’S CODE
PAN172x / PAN171x
TABLE OF CONTENTS
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
Scope of this Document .................................................................................................. 4
Difference PAN1720 / PAN1721 ..................................................................................... 4
Difference PAN172x / PAN171x ..................................................................................... 4
Key Features................................................................................................................... 4
Bluetooth Low Energy ..................................................................................................... 6
Applications for the Module............................................................................................. 6
Description for the Module .............................................................................................. 6
Detailed Description ........................................................................................................ 7
8.1. PAN172x Terminal Layout..................................................................................... 7
Bluetooth Features.......................................................................................................... 9
PAN1720 Block Diagram ................................................................................................ 9
PAN17x1 Block Diagram............................................................................................... 10
Test Conditions ............................................................................................................. 11
General Device Requirements and Operation .............................................................. 11
13.1. Absolute Maximum Ratings ................................................................................. 11
13.2. Recommended Operating Conditions.................................................................. 11
13.3. PAN1720 Current Consumption .......................................................................... 12
Bluetooth RF Performance............................................................................................ 13
14.1. PAN1720 Bluetooth Characteristics .................................................................... 13
14.2. PAN1721 Bluetooth Characteristics .................................................................... 13
14.3. PAN172X Spurious Emission .............................................................................. 13
Soldering Temperature-Time Profile (for reflow soldering) ........................................... 14
15.1. For lead solder..................................................................................................... 14
15.2. For leadfree solder............................................................................................... 14
PAN172x Module Dimension ........................................................................................ 15
PAN171x Module Dimension ........................................................................................ 16
PAN172x FootPrint of the Module................................................................................. 17
PAN171x FootPrint of the Module................................................................................. 18
Case Marking ................................................................................................................ 19
20.1. Example for Marking............................................................................................ 19
20.2. Marking Definition ................................................................................................ 19
Mechanical Requirements............................................................................................. 19
Development of Applications......................................................................................... 20
Reliability Tests ............................................................................................................. 20
Cautions ........................................................................................................................ 20
24.1. Design Notes ....................................................................................................... 20
24.2. Installation Notes ................................................................................................. 21
24.3. Usage Conditions Notes ...................................................................................... 21
24.4. Storage Notes...................................................................................................... 22
CLASS 2 BLUETOOTH LOW ENERGY
SINGLE MODE MODULE
PRODUCT SPECIFICATION
PANASONIC’S CODE
ENW89820AxKF / ENW89835AxKF
No.
DS-17xx-2400-102
PAGE
DATE
www.pideu.panasonic.de
28.01.2013
2 of 35
REV.
1.7