MC10H159P ON Semiconductor, MC10H159P Datasheet - Page 6
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MC10H159P
Manufacturer Part Number
MC10H159P
Description
IC MUX QUAD 2INP INV 16-DIP
Manufacturer
ON Semiconductor
Series
10Hr
Type
Multiplexerr
Datasheet
1.MC10H159FN.pdf
(7 pages)
Specifications of MC10H159P
Circuit
4 x 2:1
Independent Circuits
1
Voltage Supply Source
Dual Supply
Voltage - Supply
4.94 V ~ 5.46 V
Operating Temperature
0°C ~ 75°C
Mounting Type
Through Hole
Package / Case
16-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Current - Output High, Low
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC10H159P
Manufacturer:
Micron
Quantity:
10
Company:
Part Number:
MC10H159PDS
Manufacturer:
MOTOROLA
Quantity:
200
e
C
16
1
0.13 (0.005)
K
N
B
B
Z
b
D
M
16
1
E
9
8
F
A
A
E
0.10 (0.004)
A
H
1
G
0.25 (0.010)
E
VIEW P
9
8
PACKAGE DIMENSIONS
M
16X
CERAMIC DIP PACKAGE
M
T
_
http://onsemi.com
L
D
A
E
A
T
CASE 620A−01
CASE 966−01
SOEIAJ−16
SEATING
PLANE
L SUFFIX
CDIP−16
ISSUE O
ISSUE A
L
DETAIL P
L
6
0.25 (0.010)
Q
1
c
16X
M
T
M
J
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. TERMINAL NUMBERS ARE SHOWN FOR
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
Y14.5M, 1982.
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
H
DIM
A
L
M
A
b
c
D
E
e
L
Q
Z
E
E
1
1
NOTES:
MILLIMETERS
MIN
0.05
0.35
0.10
9.90
5.10
7.40
0.50
0.70
1.10
−−−
−−−
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
5 THIS DRAWING REPLACES OBSOLETE
0
1.27 BSC
_
ASME Y14.5M, 1994.
FORMED PARALLEL.
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
CASE OUTLINE 620−10.
DIM
M
A
B
C
D
E
F
G
H
K
L
N
10.50
MAX
10
2.05
0.20
0.50
0.20
5.45
8.20
0.85
1.50
0.90
0.78
_
0.750
0.240
0.015
0.055
0.008
0.125
0.020
MIN
−−−
0.050 BSC
0.100 BSC
0.300 BSC
0
INCHES
_
0.002
0.014
0.007
0.390
0.201
0.291
0.020
0.043
0.028
MIN
−−−
−−−
0.050 BSC
0
INCHES
_
0.785
0.295
0.200
0.020
0.065
0.015
0.170
0.040
MAX
15
_
0.081
0.008
0.020
0.413
0.215
0.323
0.033
0.059
0.035
0.031
MAX
0.011
10
_
19.05
MILLIMETERS
MIN
6.10
0.39
1.40
0.21
3.18
0.51
−−−
1.27 BSC
2.54 BSC
7.62 BSC
0
_
19.93
MAX
7.49
5.08
0.50
1.65
0.38
4.31
1.01
15
_