MC10EP56MNG ON Semiconductor, MC10EP56MNG Datasheet - Page 3

• Manufacturer Part Number: MC10EP56MNG
• Description: IC MUX ECL DUAL DIFF 2:1 20-QFN
• Manufacturer: ON Semiconductor
• Series: 10EPr
• Type: Differential Digital Multiplexerr

Specifications of MC10EP56MNG

• Circuit: 2 x 2:1
• Independent Circuits: 1
• Voltage Supply Source: Dual Supply
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TFQFN Exposed Pad
• Product: Multiplexer
• Logic Family: ECL
• Number Of Lines (input / Output): 4.0 / 2.0
• Propagation Delay Time: 0.47 ns at 3 V to 5.5 V
• Supply Voltage (max): - 5.5 V, + 5.5 V
• Supply Voltage (min): - 3 V, + 3 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Number Of Input Lines: 4.0
• Number Of Output Lines: 2.0
• Logical Function: Mux
• Configuration: 1 x 4:1/2 x 2:1
• Number Of Inputs: 4
• Number Of Outputs: 2
• Operating Supply Voltage (typ): -3.3/-5/3.3/5V
• Operating Supply Voltage (min): -3/3V
• Operating Supply Voltage (max): -5.5/5.5V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 20
• Package Type: QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 4. MAXIMUM RATINGS
V
V
V
I
I
T
T
q
q
q
q
q
q
T
Symbol
out
BB
A
stg
JA
JC
JA
JC
JA
JC
sol
CC
EE
I
PECL Mode Power Supply
NECL Mode Power Supply
PECL Mode Input Voltage
NECL Mode Input Voltage
Output Current
V
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Wave Solder
BB
Sink/Source
Table 3. ATTRIBUTES
1. For additional information, see Application Note AND8003/D.
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Flammability Rating
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Parameter
Characteristics
Pb−Free
Pb
http://onsemi.com
V
V
V
V
Continuous
Surge
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
Oxygen Index: 28 to 34
Charged Device Model
EE
CC
EE
CC
Condition 1
Human Body Model
= 0 V
= 0 V
= 0 V
= 0 V
Machine Model
3
TSSOP
SOIC
QFN
V
V
20 TSSOP
20 TSSOP
20 TSSOP
20 SOIC
20 SOIC
20 SOIC
QFN−20
QFN−20
QFN−20
I
I
 V
 V
Condition 2
Pb Pkg
Level 1
Level 1
CC
EE
Value
UL 94 V−0 @ 0.125 in
N/A
140 Devices
> 150 V
> 2 kV
> 2 kV
75 kW
N/A
Pb−Free Pkg
Level 3
Level 3
Level 1
Value
−65 to +150
−40 to +85
23 to 41
33 to 35
Rating
± 0.5
100
140
100
265
265
−6
−6
50
90
60
47
33
18
6
6
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
mA
mA
mA
°C
°C
°C
V
V
V
V