MC100LVEL58DTG ON Semiconductor, MC100LVEL58DTG Datasheet - Page 2

• Manufacturer Part Number: MC100LVEL58DTG
• Description: IC MULTIPLXR 2:1 3.3V ECL 8TSSOP
• Manufacturer: ON Semiconductor
• Series: 100LVELr
• Type: Multiplexerr

Specifications of MC100LVEL58DTG

• Circuit: 1 x 2:1
• Independent Circuits: 1
• Voltage Supply Source: Dual Supply
• Voltage - Supply: 3 V ~ 3.8 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP
• Product: Decoders, Encoders, Multiplexers & Demultiplexers
• Logic Family: MC100L
• Number Of Lines (input / Output): 2.0 / 1.0
• Propagation Delay Time: 0.57 ns at 3.3 V
• Supply Voltage (max): - 3.8 V, + 3.8 V
• Supply Voltage (min): - 3 V, + 3 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Number Of Input Lines: 2.0
• Number Of Output Lines: 1.0
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MC100LVEL58DTGOS

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
Table 3. MAXIMUM RATINGS
V
V
V
I
T
T
q
q
q
q
q
T
q
Symbol
out
A
stg
JA
JC
JA
JC
JA
sol
JC
CC
EE
I
Da, Db
Q, Q
SEL
V
V
NC
EP
CC
EE
PIN
Table 1. PIN DESCRIPTION
PECL Mode Power Supply
NECL Mode Power Supply
PECL Mode Input Voltage
NECL Mode Input Voltage
Output Current
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Wave Solder
Thermal Resistance (Junction−to−Case)
ECL Data Inputs
ECL Differential Data Outputs
ECL Select Input
Positive Supply
Negative Supply
No Connect
(DFN8 only) Thermal exposed pad must be connected
to a sufficient thermal conduit. Electrically connect to
the most negative supply (GND) or leave unconnected,
floating open.
Parameter
FUNCTION
Figure 1. Logic Diagram and Pinout Assignment
SEL
NC
Da
Db
Pb−Free
1
2
3
4
Pb
http://onsemi.com
V
V
V
V
Continuous
Surge
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
(Note 1)
EE
CC
EE
CC
Condition 1
= 0 V
= 0 V
= 0 V
= 0 V
2
1
MUX
0
Table 2. TRUTH TABLE
V
V
8 SOIC
8 SOIC
8 SOIC
8 TSSOP
8 TSSOP
8 TSSOP
DFN8
DFN8
DFN8
8
7
6
5
I
I
 V
 V
Condition 2
V
Q
Q
V
CC
EE
CC
EE
SEL
H
L
41 to 44 ± 5%
41 to 44 ± 5%
−65 to +150
−40 to +85
35 to 40
Rating
−8 to 0
−6 to 0
8 to 0
6 to 0
100
190
130
185
140
129
265
265
50
84
Data
a
b
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
mA
mA
°C
°C
°C
V
V
V
V