LM4867MT NOPB National Semiconductor, LM4867MT NOPB Datasheet - Page 7
LM4867MT NOPB
Manufacturer Part Number
LM4867MT NOPB
Description
Manufacturer
National Semiconductor
Datasheet
1.LM4867MT_NOPB.pdf
(30 pages)
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Typical Performance Characteristics
MTE- and LQ- Specific Characteristics
Note 18: This curve shows the LM4867MTE’s thermal dissipation ability at different ambient temperatures given these conditions:
it. Board information - copper dimensions: 74x74mm, copper coverage: 100% (buried layer) and 12% (top/bottom layers), 16 vias under the exposed-DAP.
500LFPM + JEDEC board: The part is soldered to a 1S2P 20-lead exposed-DAP TSSOP test board with 500 linear feet per minute of forced-air flow across
500LFPM + 2.5in
2.5in
Not Attached: The part is not soldered down and is not forced-air cooled.
2
: The part is soldered to a 2.5in
Power Dissipation vs Power Output
2
: The part is soldered to a 2.5in
LM4867LQ, LM4867MTE
Power Derating Curve
LM4867LQ
2
, 1oz. copper plane.
2
, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.
20001369
20001361
6
(Continued)
Power Derating Curve
LM4867MTE (Note 18)
20001359
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