MPXV7025 FREESCALE [Freescale Semiconductor, Inc], MPXV7025 Datasheet
MPXV7025
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MPXV7025 Summary of contents
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... Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXV7025 series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced ...
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... Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPXV7025 5.0 Vdc 25° ...
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... V S Thin Film Gain Stage #2 and Temperature Ground Compensation and Reference Gain Stage #1 Shift Circuitry Pins and 8 are NO CONNECTS for Small Outline Package Device GND 3 Pressure Value Unit 200 kPa °C –40 to +125 °C –40 to +125 4 V out MPXV7025 3 ...
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... Pressure On-chip Temperature Compensation and Calibration The MPXV7025 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application ...
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... NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Pressure Error Band 3.0 2.0 1.0 0.0 –1.0 –2.0 –3.0 Sensors Freescale Semiconductor (P x 0.018 + 0. MPXV7025 SERIES Temp Multiplier – +125 3 –40 – Temperature in °C ...
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... The pressure Part Number MPXV7025GC6U/C6T1, MPVZ7025GC6U/T1 MPXV7025GP, MPVZ7025GP MPXV7025DP, MPVZ7025DP MPVZ7025G6U/T1 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package ...
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... MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 B 0.415 0.425 10.54 10.79 C 0.212 0.230 5.38 5.84 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.405 0.415 10.29 10.54 S 0.709 0.725 18.01 18.41 MPXV7025 7 ...
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... Pressure 2 PLACES 4 TIPS 0.006 (0.15 0.004 (0. DETAIL G C MPXV7025 8 PACKAGE DIMENSIONS GAGE e PLANE e/2 .014 (0.35 STYLE 1: STYLE 2: 0.004 (0. PIN 1. GND PIN 1. N/C 2. +Vout -Vout 5. N/C 6. N/C 7. N/C 8. N/C ∅ SEATING PLANE CASE 1351-01 ...
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... MIN MAX MIN MAX A 0.300 0.330 7.11 7.62 A1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 D 0.465 0.485 11.81 12.32 0.717 BSC 18.21 BSC E E1 0.465 0.485 11.81 12.32 e 0.100 BSC 2.54 BSC F 0.245 0.255 6.22 6.47 K 0.120 0.130 3.05 3.30 L 0.061 0.071 1.55 1.80 M 0.270 0.290 6.86 7.36 N 0.080 0.090 2.03 2.28 P 0.009 0.011 0.23 0.28 T 0.115 0.125 2.92 3.17 θ 0˚ 7˚ 0˚ 7˚ MPXV7025 9 ...
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... Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MPXV7025 Rev. 5 1/2009 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document ...