MPXV5050V FREESCALE [Freescale Semiconductor, Inc], MPXV5050V Datasheet
MPXV5050V
Related parts for MPXV5050V
MPXV5050V Summary of contents
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... On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXV5050V series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale Semiconductor, Inc. pressure sensor a logical and economical choice for the system designer ...
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... Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. 8. Offset ( defined as the output voltage at the minimum rated pressure. off MPXV5050VC6T1 2 = 5.0 Vdc 25°C unless otherwise noted, P1 > P2) S ...
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... Freescale Semiconductor Symbol P max T stg Gain Stage #2 Thin Film And Temperature Compensation Ground And Reference Gain Stage #1 Shift Circuitry Pins and 8 are no connects 3 GND Pressure Value Units 200 kPa °C -40 to +125 °C -40 to +125 4 V out MPXV5050VC6T1 3 ...
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... Contact the factory for information regarding media compatibility in your application. Stainless Steel Cap Thermoplastic Case 1.0 μF Die Bond Figure 3. Typical Application Circuit (Output Source Current Operation) Transfer Function MPXV5050VC Series ) s TYPICAL MIN –30 –20 Pressure (kPa) Figure 4. Output vs. Absolute Pressure +5 V ...
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... Transfer Function (MPXV5050V) Nominal Transfer Value OUT ± (Pressure Error x Temp Multi x 0.018 5.0 ± 0. Temperature Error Band 4.0 3.0 Temperature 2.0 Error Factor 1.0 0.0 NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Pressure Error Band 1 ...
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... With the correct pad geometry, the packages will self-align when subjected to a 0.060 TYP 8X 1.52 MPXV5050VC6T1 6 SURFACE MOUNTING INFORMATION solder reflow process always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts ...
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... ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. INCHES MILLIMETERS DIM MIN MAX MIN MAX A 0.415 0.425 10.54 10.79 B 0.415 0.425 10.54 10.79 C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 -T- SEATING PLANE MPXV5050VC6T1 7 ...
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... For Literature Requests Only: Freescale Semiconductor Literature Distribution Center 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MPXV5050VC6T1 Rev. 2 11/2009 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document ...