TSL2560 TAOS [TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS], TSL2560 Datasheet - Page 40

• Manufacturer Part Number: TSL2560
• Description: LIGHT-TO-DIGITAL CONVERTER
• Manufacturer: TAOS [TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS]

TSL2560, TSL2561
LIGHT-TO-DIGITAL CONVERTER
TAOS059Q − NOVEMBER 2009
40
Copyright E 2009, TAOS Inc.
The CS, T, FN, and CL packages have been tested and have demonstrated an ability to be reflow soldered to
a PCB substrate. The process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
T
peak
T
T
T
3
2
1
Time (sec)
Average temperature gradient in preheating
Soak time
Time above 217°C
Time above 230°C
Time above T
Peak temperature in reflow
Temperature gradient in cooling
Figure 31. TSL2560/TSL2561 Solder Reflow Profile Graph
peak
PARAMETER
Table 13. TSL2560/61 Solder Reflow Profile
−10°C
MANUFACTURING INFORMATION
t
soak
r
www.taosinc.com
REFERENCE
T
t
soak
peak
t
t
t
1
2
3
260° C (−0°C/+5°C)
r
2 to 3 minutes
Max −5°C/sec
TSL2560/61
Max 60 sec
Max 50 sec
Max 10 sec
2.5°C/sec
t
t
t
3
2
1
Not to scale — for reference only
The LUMENOLOGY r Company