CXG1022 Sony Corporation, CXG1022 Datasheet

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CXG1022

Manufacturer Part Number
CXG1022
Description
High-Frequency SPDT Antenna Switch
Manufacturer
Sony Corporation
Datasheet

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Description
This IC is designed using the Sony’s GaAs J-FET
process and operates at a single positive power
supply with an ultra-small package.
Features
• Single positive power supply operation
• Insertion loss
• Medium power switching
• Ultra-small TSSOP package
Applications
Structure
The CXG1022TM is an antenna switch MMIC.
P1dB (Typ.)
Antenna switch for digital cordless telephones
GaAs J-FET MMIC
High-Frequency SPDT Antenna Switch
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
0.4 dB (Typ.)
29 dBm
33 dBm
V
V
CTL
CTL
at 2.0 GHZ
at 2.0 GHz
at 2.0 GHz
(H)=3.0 V
(H)=4.0 V
—1—
Absolute Maximum Ratings (Ta=25 °C)
• Control voltage
• Operating temperature
• Storage temperature
Operating Condition
Control voltage
CXG1022TM
10 pin TSSOP (Plastic)
Topr
Tstg
Vctl
–65 to +150
–35 to +85
0/3
6
E96547A71-TE
°C
°C
V
V

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CXG1022 Summary of contents

Page 1

... High-Frequency SPDT Antenna Switch Description The CXG1022TM is an antenna switch MMIC. This IC is designed using the Sony’s GaAs J-FET process and operates at a single positive power supply with an ultra-small package. Features • Single positive power supply operation • Insertion loss 0.4 dB (Typ.) • ...

Page 2

... V 26 CTL V ( CTL Pin Configuration CTLB Port3 Port1 Port2 CTLA —2— Typ. Max. 0.3 0.6 31 0.4 0.8 26 1.3 1.5 1.3 1 100 GND GND 10pin TSSOP (PLASTIC) CXG1022TM (Ta=25 °C) Unit µA (Ta=25 °C) dBm dBm Port3 GND GND GND Port2 ...

Page 3

... Input power (dBm) Insertion loss, isolation vs. Frequency 0 Insertion loss –1 –2 –3 Isolation –4 – Frequency (GHz) —3— Port3 10 100pF Port2 6 100pF (H)=5V CTL V (H)=4V CTL V (H)=3V CTL (H)=3V CTL V (H)=4V CTL V (H)=5V CTL –10 –20 –30 –40 –50 3 CXG1022TM ...

Page 4

... NOTE: “ ” Dimensions do not include mold protrusion. SONY CODE EIAJ CODE JEDEC CODE 10PIN TSSOP(PLASTIC 0.5 0.1 M (0.2) + 0.08 0.22 – 0.07 PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT TSSOP-10P-L01 LEAD MATERIAL PACKAGE MASS —4— 1.2MAX 0.1 + 0.15 0.1 – 0.05 0.25 0° to 10° DETAIL A EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g CXG1022TM ...

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