EM6AA320-XXMS ETRON [Etron Technology, Inc.], EM6AA320-XXMS Datasheet - Page 9

• Manufacturer Part Number: EM6AA320-XXMS
• Description: 8M x 32 DDR SDRAM
• Manufacturer: ETRON [Etron Technology, Inc.]

D.C. Characteristics
(V
OPERATING CURRENT : One bank; Active-Precharge;
t
changing once per clock cycle; Address and control
inputs changing once every two clock cycles.
OPERATING CURRENT : One bank; Active-Read-
Precharge; BL=4; CL=4; tRCDRD=4*t
t
changing once per clock cycle
PRECHARGE POWER-DOWN STANDBY CURRENT:
All banks idle; power-down mode; t
CKE=LOW
IDLE STANDLY CURRENT : CKE = HIGH;
CS#=HIGH(DESELECT); All banks idle; t
Address and control inputs changing once per clock
cycle; V
ACTIVE POWER-DOWN STANDBY CURRENT : one
bank active; power-down mode; CKE=LOW;
t
ACTIVE STANDBY CURRENT :
CS#=HIGH;CKE=HIGH; one bank active ;
t
changing once per clock cycle; DQ,DQS,and DM inputs
changing twice per clock cycle
OPERATING CURRENT BURST READ : BL=2; READS;
Continuous burst; one bank active; Address and control
inputs changing once per clock cycle; t
lout=0mA;50% of data changing on every transfer
OPERATING CURRENT BURST Write : BL=2;
WRITES; Continuous Burst ;one bank active; address
and control inputs changing once per clock cycle;
t
cycle; 50% of data changing on every transfer
AUTO REFRESH CURRENT : t
t
SELF REFRESH CURRENT: Sell Refresh Mode ;
CKE<=0.2V;t
BURST OPERATING CURRENT 4 bank operation:
Four bank interleaving READs; BL=4;with Auto
Precharge; t
control inputschang only during Active, READ , or WRITE
command
Note:
1. Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent
2. All voltages are referenced to V
3. These parameters depend on the cycle rate and these values are measured by the cycle rate
4. Power-up sequence is described in previous page.
RC
CK
CK
RC
CK
CK
DD
=t
=t
=t
=t
=t
=t
damage of the device.
under the minimum value of t
=2.5 ± 5%, T
CK
CK
CK
CK
RC
RC
(min); lout=0mA; Address and control inputs
(min)
(min); DQ,DQS,and DM changing twice per clock
(min)
(min); t
(max);t
IN
=V
RC
REF
CK
A
Parameter & Test Condition
=t
CK
CK
= 0~70 °C)
=t
for DQ, DQS and DM
RC
=t
=t
CK
CK
CK
(min); t
(min)
(min); DQ,DM and DQS inputs
(min);Address and control inputs
CK
=t
CK
RC
CK
(min); Address and
SS
=t
CK
and t
.
RFC
=t
CK
CK
CK
; t
RC
(min);
=t
8Mx32 DDR SDRAM
CK
(min);
RC
. Input signals are changed one time during t
CK
=t
=t
(min);
CK
RC
(min);
(min);
9
Symbol
IDD4W
IDD2N
IDD3N
IDD4R
IDD2P
IDD3P
IDD0
IDD1
IDD5
IDD6
IDD7
1100 1050 1000 950
500
600
120
210
120
300
640
550
750
3.3
8
EM6AA320-XXMS
460
540
120
200
120
280
610
525
720
3.6
8
Max
350
480
100
175
100
260
580
500
650
Rev 0.7
4
5
CK
310
440
170
240
550
480
610
80
80
5
5
.
280
400
170
240
520
460
580
900
80
80
6
5
May. 2006
Unit
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA