EMIF06-VID01F2_08 STMICROELECTRONICS [STMicroelectronics], EMIF06-VID01F2_08 Datasheet - Page 5

no-image

EMIF06-VID01F2_08

Manufacturer Part Number
EMIF06-VID01F2_08
Description
6-line IPAD, low capacitance EMI filter and ESD protection
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
EMIF06-VID01F2
Note:
Figure 12. Flip Chip tape and reel specification
More packing information is available in the application note
AN1235: “Flip Chip: Package description and recommendations for use”
AN1751: “EMI Filters: Recommendations and measurements”
Figure 10. Footprint recommendations
340 µm min for 300 µm copper pad diameter
Solder mask opening recommendation:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
All dimensions in mm
Copper pad diameter:
0.73 ± 0.05
Dot identifying Pin A1 location
User direction of unreeling
Figure 11. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = date code
(y = year
4 ± 0.1
ww = week)
1.52
4 ± 0.1
Ø 1.5 ± 0.1
Package information
x
y
w
x
E
w
z
5/7

Related parts for EMIF06-VID01F2_08