EMIF06-HMC01F1 STMICROELECTRONICS [STMicroelectronics], EMIF06-HMC01F1 Datasheet - Page 5

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EMIF06-HMC01F1

Manufacturer Part Number
EMIF06-HMC01F1
Description
6 LINES EMI FILTER INCLUDING ESD PROTECTION
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Figure 10: Ordering Information Scheme
Figure 11: FLIP-CHIP Package Mechanical Data
Figure 12: Foot Print Recommendations
340µm min for 315µm copper pad diameter
Solder mask opening recommendation :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Copper pad Diameter :
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip-Chip
x = 1: 500µm, Bump = 315µm
500µm ± 10
= 2: Leadfree Pitch = 500µm, Bump = 315µm
= 3: Leadfree Pitch = 400µm, Bump = 250µm
1.92mm ± 50µm
315µm ± 50
EMIF
Figure 13: Marking
Dot, ST logo
xx = marking
z = packaging location
yww = datecode
All dimensions in µm
yy
(y = year
ww = week)
-
xxx zz
650µm ± 65
Fx
365
EMIF06-HMC01F2
x
y
240
w
x
w
E
z
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