EMIF04-MMC02F2_08 STMICROELECTRONICS [STMicroelectronics], EMIF04-MMC02F2_08 Datasheet - Page 6

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EMIF04-MMC02F2_08

Manufacturer Part Number
EMIF04-MMC02F2_08
Description
4-line IPAD, EMI filter including ESD protection
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Ordering information
5
Note:
6/8
Figure 14. Flip Chip tape and reel specification
Ordering information
Table 3.
More packing information is available in the applications note:
AN1235: “Flip Chip: package description and recommendations for use”
AN 1751: “EMI filters: Recomendations and measurements”
Figure 12. Footprint
EMIF04-MMC02F2
340 µm min for 315 µm copper pad diameter
Solder mask opening recommendation:
Order code
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Copper pad Diameter:
Ordering information
All dimensions in mm
0.73 ± 0.05
Marking
FH
Dot identifying Pin A1 location
Package
Flip Chip
User direction of unreeling
Figure 13. Marking
4 ± 0.1
2.17
Weight
4.5 mg
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
4 ± 0.1
(y = year
ww = week)
Base qty
Ø 1.5 ± 0.1
5000
EMIF04-MMC02F2
x
y
Tape and reel (7”)
Delivery mode
w
x
w
E
z

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