EMIF04-10006XF STMICROELECTRONICS [STMicroelectronics], EMIF04-10006XF Datasheet

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EMIF04-10006XF

Manufacturer Part Number
EMIF04-10006XF
Description
4 LINES EMI ILTER AND ESD PROTECTION
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
MAIN PRODUCT CHARACTERISTICS
Where EMI filtering in ESD sensitive equipment is
required:
DESCRIPTION
The EMIF04-10006F2 is a highly integrated
devices designed to suppress EMI/RFI noise in all
systems
interferences. The EMIF04 flip-chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents the device from destruction when
subjected to ESD surges up 15kV. This device
includes four EMIF filters and 4 separated ESD
diodes.
BENEFITS
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC 61000-4-2 level 4:
MIL STD 883E - Method 3015-6 Class 3: 30kV
TM: IPAD is a trademark of STMicroelectronics.
September 2004
Mobile phones and communication systems
Computers, printers and MCU Boards
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Lead free package
Very low PCB space consuming:
2.92mm x 1.29mm
Very thin package: 0.65 mm
High efficiency in ESD suppression
(IEC61000-4-2 level 4)
High reliability offered by monolithic integration
High reducing of parasitic elements through
integration and wafer level packaging.
®
subjected
IPAD™
15kV (air discharge)
8kV
(contact discharge)
to
electromagnetic
REV. 1
Figure 1: Pin Configuration (ball side)
Table 1: Order Code
EMIF04-10006F2
D3
D4
9
Part Number
Gnd
AND ESD PROTECTION
8
O4
I4
7
EMIF04-10006F2
4 LINES EMI FILTER
O3
(15 Bumps)
I3
6
Flip-Chip
Gnd
5
O2
I2
4
Marking
O1
I1
3
FS
Gnd
2
D2
D1
1
1/7
A
B
C

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EMIF04-10006XF Summary of contents

Page 1

... Where EMI filtering in ESD sensitive equipment is required: ■ Mobile phones and communication systems ■ Computers, printers and MCU Boards DESCRIPTION The EMIF04-10006F2 is a highly integrated devices designed to suppress EMI/RFI noise in all systems subjected to interferences. The EMIF04 flip-chip packaging means the package size is equal to the die size. ...

Page 2

... EMIF04-10006F2 Figure 2: Basic Cell Configuration 100Ω Input 1 30pF 30pF 100Ω Input 2 30pF 30pF 100Ω Input 3 30pF 30pF Table 2: Absolute Ratings (limiting values) Symbol Parameter and test conditions P DC power per resistance R P Total DC power per package T T Maximum junction temperature ...

Page 3

... Figure 6: ESD response to IEC61000-4-2 (+15kV air discharge) on one imput V(in) and one output V(out) Figure 8: Line capacitance versus applied voltage for filter 100 0.0 EMIF04-10006F2 Aplac 7.62 User: ST Microelectronics Aplac 7.62 User: ST Microelectronics dB dB i3_o2.s2p 1M 10M 100M F=1MHz V =30mV osc T =25°C j 0.5 1 ...

Page 4

... Lbump Ii* Cbump Cz=41pF@0V Rsub Output of each filter cell Ii* = Input of each filter cell Rbump Lbump Dj * Cbump Cz=41pF@0V Rsub With Dj & D3 And Di & D4 EMIF04-10006F2 model Figure 10: Aplac parameters 4/7 Rs=100 Lbump Rbump Cz=41pF@0V Cbump Rsub sub sub Lbump Rbump Cz=41pF@0V Cbump Rsub ...

Page 5

... EMIF yy - 315µm ± 50 2.92mm ± 50µm Figure 14: Marking Dot, ST logo xx = marking z = packaging location yww = datecode (y = year ww = week) All dimensions in µm EMIF04-10006F2 xxx zz Fx 650µm ± 65 400 545 5/7 ...

Page 6

... Dot identifying Pin A1 location 0.73 +/- 0.05 All dimensions in mm Table 4: Ordering Information Ordering code Marking EMIF04-10006F2 FS Note: More packing informations are available in the application note AN1235: “Flip-Chip: Package description and recommendations for use” AN1751: "EMI Filters: Recommendations and measurements" Table 5: Revision History ...

Page 7

... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America All other names are the property of their respective owners © 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com EMIF04-10006F2 7/7 ...

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