M515 MA-COM [M/A-COM Technology Solutions, Inc.], M515 Datasheet

M515

Manufacturer Part Number

M515

Description

Techniques to Achieve High Isolation with GaAs MMIC Switch Chips

Manufacturer

MA-COM [M/A-COM Technology Solutions, Inc.]

Datasheet

1.M515.pdf (1 pages)

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Techniques to Achieve High Isolation with GaAs MMIC Switch

Chips

Application Note

M515

Mounting Techniques

1. Mount the base of the chip directly on the

2. Use short ribbon bonds (0.005 to 0.010” wide)

3. Elevate the ground plane to be at the same

A. Using ground plane pedestals next to the chip,

Ribbon Bond

Ground Plane

B. Depressing the chip into a channel in the

Isolation performance of a GaAs MMIC switch

can be degraded by parasitic effects introduced

by the circuit in which the MMIC is used. Two

primary causes of isolation degradation are

excessive

crosstalk between RF paths (external to the

MMIC). This note will focus on techniques to

reduce ground path inductances.

Ground Plane

Ribbon Bond

ground plane (i.e. the metal floor of the

package) and use short connections from the

ground pads of the MMIC to the ground plane.

instead of wirebonds in the connection of the

ground pads to ground.

level as the ground pads on the chip surface.

This can be done by:

as shown.

ground plane, as shown.

ground

path

inductances

Chip

Pedestal

Chip

and

The achievable isolation of a GaAs MMIC switch

is a function of how low an inductance one can

achieve between the ground pad of the MMIC

and the ground plane within a particular circuit.

The lower the inductance, of course, the higher

the isolation that can be achieved.

For

MASW6010G* chip in the catalog were obtained

using coplanar RF probes directly on the chip

Because this is a coplanar probe configuration

(which also includes the ground plane), there is

virtually

measurement. Thus, the isolation obtained in the

data sheet is for a very small ground inductance

that exists and should be considered optimum.

However,

MASW6020G* chip in the catalog were obtained

with the chip mounted in a package having a flat

ground plane on the floor of the pads to the

ground plane. Thus, the isolation obtained in the

data sheet is when a finite inductance exists in

the ground path.

In practice when a chip is mounted into a circuit,

there will always be some finite inductance which

can degrade the isolation performance. Several

precautions can be taken to improve the isolation

within a particular circuit. (see box)

The technique used by M/A-COM in most of the

packaged MMIC switch products is that of #1

above. Catalog performance of these products

can be used as an indicator of what can be

expected if technique #1 is used.

improvements can be expected in isolation

performance if techniques 2 or 3 are used.

This note briefly described techniques to obtain

the maximum possible isolation when using a

GaAs MMIC switch chips. Several options were

outlined which involved varying degrees of

complexity. Crosstalk, not addressed here, can

also degrade isolation, and must minimized to

obtain overall performance.

* Part number MASW6010G supersedes SW-200 and

MASW6020G supersedes SW-210.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.4155721

example,

the

ground

the

isolation

curves

inductance

• China Tel: +86.21.2407.1588

curves

shown

However,

for

Rev. V4

the

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