MX27C8000AMC-10 MCNIX [Macronix International], MX27C8000AMC-10 Datasheet - Page 3

• Manufacturer Part Number: MX27C8000AMC-10
• Description: 8M-BIT [1M x8] CMOS EPROM
• Manufacturer: MCNIX [Macronix International]

P/N: PM00764
should be used for device selection. Output Enable (OE)
is the output control and should be used to gate data to
the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tOE after the falling edge
of OE's, assuming that CE has been LOW and
addresses have been stable for at least tACC - tOE.
STANDBY MODE
The MX27C8000A has a CMOS standby mode which
reduces the maximum VCC current to 100 uA. It is
placed in CMOS standby when CE is at VCC ± 0.3 V. The
MX27C8000A also has a TTL-standby mode which
reduces the maximum VCC current to 1.5 mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.
TWO-LINE OUTPUT CONTROL FUNCTION
To accommodate multiple memory connections, a two-
line control function is provided to allow for:
MODE SELECT TABLE
NOTES:
1. VH = 12.0 V ± 0.5 V
2. X = Either VIH or VIL
3. A1 - A8 = A10 - A19 = VIL (For auto select)
4. See DC Programming Characteristics for VPP voltage during programming
1. Low memory power dissipation,
MODE
Read
Output Disable
Standby (TTL)
Standby (CMOS)
Program
Program Verify
Program Inhibit
Manufacturer Code(3)
Device Code(3)
CE
VIL
VIL
VIH
VIL
VIL
VIH
VIL
VIL
VCC±0.3V
OE/VPP
VIL
VIH
X
X
VPP
VIL
VPP
VIL
VIL
3
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and
connected to the READ line from the system control bus.
This assures that all deselected memory devices are in
their low-power standby mode and that the output pins
are only active when data is desired from a particular
memory device.
SYSTEM CONSIDERATIONS
During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
VCC and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between VCC and GND for each eight devices. The
location of the capacitor should be close to where the
power supply is connected to the array.
2. Assurance that output bus contention will not
occur.
PINS
A0
X
X
X
X
X
X
X
VIL
VIH
MX27C8000A
A9
X
X
X
X
X
X
X
VH
VH
REV.1.2, JUL. 19, 2001
OUTPUTS
DOUT
High Z
High Z
High Z
DIN
DOUT
High Z
C2H
02H