MAS9270C2SN06 MAS [Micro Analog systems], MAS9270C2SN06 Datasheet - Page 6

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MAS9270C2SN06

Manufacturer Part Number
MAS9270C2SN06
Description
IC FOR 10.00 - 30.00 MHz VCTCXO
Manufacturer
MAS [Micro Analog systems]
Datasheet
SOLDERING INFORMATION
N For Sn/Pb MSOP-10
N For Pb Free, RoHS Compliant MSOP-10
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Lead Finish
Thermal profile parameters stated in JESD22-A113 should not
Thermal profile parameters stated in IPC/JEDEC J-STD-020
Solder plate 7.62 - 25.4 µm, material Sn 85% Pb 15%
According to RSH test IEC 68-2-58/20 2*220°C
Solder plate 7.62 - 25.4 µm, material Matte Tin
should not be exceeded.
According to RSH test IEC 68-2-58/20
be exceeded.
max 0.08 mm
240°C
http://www.jedec.org
260°C
2
3
http://www.jedec.org
11 September 2006
DA9270.008
6 (9)

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